Honeywell International Inc.

Ya Qun Liu

Liqiang Zhang

Hong Min Huang

Ling Shen

Kai Zhang

Huifeng Duan

Wei Jun Wang

Haigang Kang

Hui Wang

Zhe Ding

Liang Zeng

Bright Zhang

Rajiv R Singh

Jun Hui Liu

Yanming Shen

Yu Wang

Xin Zhang

Wanchao Jiang

Wei Chang

Carol Gao

Limei Cui

Albert Peng

Yaqin Mao

Rongwei Pan

Yunzi Jiang

David K Chen

The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material is soft and has elastic properties post-curing along with high thermally conductive filler loading. The thermal interface material includes at least one long chain alkyl silicone oil; at least one long chain, vinyl terminated alkyl silicone oil; at least one long chain, single end hydroxyl terminated silicone oil; at least one thermally conductive filler, at least one coupling agent, at least one catalyst, at least one crosslinker, and at least one addition inhibitor.

Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material comprises at least one silicone oil, at least one catalyst, at least one thermally conductive filler having a larger surface area, a solvent, at least one inhibitor, and at least one crosslinker. The at least one thermally conductive filler reduces the oil leakage of the TIM, and the solvent increases the flow rate of the TIM without negating the reduction of oil leakage realized by the thermally conductive fillers.

Gel-type thermal interface material

The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.

Silicone-free thermal gel

A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80 wt. % of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

Thermal interface material including crosslinker and multiple fillers

The production of solvents for applications such as heat transfer, cleaning, and degreasing, for example. In particular, the production of solvents derived from 1-chloro-3,3,3-trifluoro-propene, such as chloro and/or fluoro substituted alkanes and chloro and/or fluoro substituted trifluoropropenyl ethers.

Methods for producing solvents derived from 1-chloro-3, 3, 3-trifluoro-propene (1233zd)

A thermal interface structure for electronic devices, such as telecommunications or data networking hardware, that utilize optical transceiver modules which are inserted within cage receptacles of the electronic devices. In order to provide for efficient heat transfer, the thermal interface structure is disposed between, and in abutment with, the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer including a phase change material, and a polymer layer connected to the thermal interface layer.

Thermal interface structure for optical transceiver modules

A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.

The present disclosure provides a two component releasable thermal gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The two component releasable thermal gel is mixed before the point of application and facilitates catalytic cross-linking. The thermal gel includes a first component including a primary silicone oil, an inhibitor, a catalyst, and at least one thermally conductive filler, and a second component including a primary silicone oil, a cross linking silicone oil, and at least one thermally conductive filler, wherein the ratio of total content of Si&#x2014;H groups to total content of vinyl groups in the thermal gel is between 0.03 to 10. The thermal gel is releasable from a substrate upon which the thermal gel is applied.

Releasable thermal gel

A thermal interface material includes at least one polymer, at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.

Thermal interface material with ion scavenger

The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.

Thermal interface materials including a coloring agent

A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

High performance thermal interface materials with low thermal impedance

Poly fluorine-containing siloxane coatings having improved hydrophobic and oleophobic properties and solutions for creating such coatings are provided. In some embodiments, the coating includes a polymer having a plurality of Si&#x2014;O&#x2014;Si linkages; and at least two fluorine-containing moieties, each attached to at least one of the Si&#x2014;O&#x2014;Si linkages. Each fluorine-containing moiety independently includes a linking portion attached to a silicon of one of the Si&#x2014;O&#x2014;Si linkages, wherein the linking portion is of a formula selected from the group consisting of: &#x2014;[CH]&#x2014; where a is an integer from 1 to 10 and &#x2014;[CH]CONH[CH]&#x2014; where b and c are independently an integer from 0 to 10. Each fluorine-containing moiety also independently includes a fluorinated portion attached to the linking portion, wherein the fluorinated portion is selected from a fluorinated-alkyl group having 1-10 carbon atoms and a perfluoro-ether containing organic group.

Poly fluorine-containing siloxane coatings

A coated substrate includes a sapphire substrate and an anti-reflective coating comprising a silicon-based material, wherein the anti-reflective coating has refractive index of 1.23 to 1.45 and a Mohs hardness of at least 4. A method of coating a sapphire substrate with an anti-reflective coating includes applying a liquid formulation to a sapphire substrate to form a coated substrate, and curing the coated substrate at a temperature of at least 500&#xb0; C. to form an anti-reflective layer on the sapphire substrate.

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Shanghai, China

Ya Qun Liu