Epistar Corporation

Ya-Lan Yang

Ta-Cheng Hsu

Ya-Ju Lee

Ying-Yong Su

Chao-Shun Huang

Ching-Shian Yeh

Min-Hsun Hsieh

Jung-Min Hwang

Chien-Fu Shen

Tsun-Kai Ko

De-Shan Kuo

Schang-Jing Hon

Ting-Chia Ko

Chien-Kai Chung

Tzu-Feng Tseng

Wen-Huang Liu

Wei-Chih Peng

Ching-San Tao

Chi-Wei Lu

Jr-Peng Ni

Meng-Lnn Tsai

Min-Hsun Liu

A light-emitting device comprises a textured substrate comprising a plurality of textured structures, wherein the textured structures and the textured substrate are both composed of sapphire; and a light-emitting stack overlaying the textured substrate, comprising a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, wherein each of the plurality of textured structures comprises a top portion having a first top-view shape, and a bottom portion parallel to the top portion and having a second top-view shape, wherein the first top-view shape comprises a circle or an ellipse, the first top-view shape comprises a first periphery and the second top-view shape comprises a second periphery, the first periphery is enclosed by the second periphery, and various distances are between each of the first periphery and the second periphery.

Light-emitting device having a patterned substrate and the method thereof

A light-emitting device comprises a textured substrate comprising a plurality of textured structures, wherein the textured structures and the textured substrate are both composed of sapphire; and a light-emitting stack overlaying the textured substrate, comprising a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, wherein one of the plurality of textured structures comprises a top portion and a bottom portion, wherein a first distance between a first projection of the top portion on the bottom portion and the bottom portion at one side is different from a second distance between a second projection of the top portion on the bottom portion and the bottom portion at another side.

A light-emitting device comprises a textured substrate comprising a boundary and a plurality of textured structures within the boundary, wherein the textured structures and the textured substrate are both composed of sapphire; and a light-emitting stack overlaying the textured substrate, comprising a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, wherein each of the plurality of textured structures comprises a top portion having a first top-view shape and a bottom portion parallel to the top portion, the bottom portion having a second top-view shape, wherein the first top-view shape comprises a circle or ellipse and the second top-view shape comprises a polygon, wherein the first top-view shape and the second top-view shape overlap each other, and the textured structures are spaced apart from each other from a top view of the light-emitting device.

Light-emitting device

This disclosure provides a light-emitting device including a patterned substrate and the manufacturing method thereof. The patterned substrate has a plurality of depressions and/or extrusions for scattering light emitted from a light-emitting layer. Each of the plurality of depressions and/or extrusions comprises a top portion, a bottom portion, and a sidewall portion enclosing the top portion and the bottom portion, and at least part of the sidewall portion comprises a curve. In a preferred embodiment, the light-emitting device further comprises a rough surface formed on at least one of the top portion, the bottom portion, and the sidewall portion.

A method of manufacturing a light-emitting device comprising the steps of cutting a substrate by a laser beam to form a cavity in the substrate and generate a by-product directly on the substrate by the cutting, and removing the by-product by a chemical solution containing an acid under a predetermined cleaning temperature.

Method for manufacturing high efficiency light-emitting diodes

A method for manufacturing a light-emitting device comprising the steps of: providing a substrate comprising a first surface and a second surface; forming a plurality of cutting lines on the substrate by a laser beam; cleaning the substrate by a chemical solution; and forming a light-emitting stack on an first surface of the substrate after cleaning the substrate.

Organic adhesive light-emitting device with ohmic metal bulge. The organic adhesive light-emitting device includes a conductive substrate, a light-emitting stack layer, a metal layer formed over the conductive substrate, a reflective layer formed over the light-emitting stack layer, and an organic adhesive layer having an ohmic metal bulge and an adhesive material around the ohmic metal bulge. The adhesive material bonds the metal layer and the reflective layer together, while the ohmic metal bulge forms ohmic contacts with the metal layer and the reflective layer. The configuration can simplify a light-emitting diode.

Organic adhesive light-emitting device with ohmic metal bulge

A light-emitting device comprising a substrate, a light-emitting stack, and a transparent adhesive layer having wavelength-converting materials embedded therein formed within the light-emitting device is provided.

Light-emitting device having wavelength-converting materials therewithin

A method for manufacturing a light-emitting device comprising the steps of cutting a light-emitting unit by a laser beam, and cleaning the light-emitting unit by an acid solution to remove by-products resulted from the laser cutting.

Light emitting device having a patterned substrate and the method thereof

An organic adhesive light-emitting device with an ohmic metal contact, including a conductive substrate having a first surface and a second surface over the upper surface, a light-emitting stack layer, an ohmic metal bulge formed over the first surface of the conductive substrate, a reflection layer formed over the light-emitting stack layer, a first reaction layer formed over the ohmic metal bulge and the second surface of the conductive substrate, a second reaction layer formed over the reflection layer, and an organic adhesive material. The reaction layer can punch through the organic adhesive material for forming the ohmic contact with the first reaction layer bonded to the second reaction layer by the organic adhesive material, and with the ohmic metal bulge.

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Hsinchu, Taiwan

Ya-Lan Yang