Industrial Technology Research Institute

Topco Technologies Corp.

Ya-Lan Chuang

Chih-Hsiang Lin

Hsin-Ching Kao

Shu-Ling Yeh

Chin-Lang Wu

Cing-Jiuh Kang

Pei-Jung Tsat

Feng-Chih Chang

Pei-Jung Tsai

Tang-Jung Wu

A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode.

Method for packaging light emitting diode

The disclosed is a copolymer having a formula as: Ris a combination of naphthalene, phenylene, butyl, and hexyl. Ris a combination of ethylene, cyclohexlene, 2-methylpropyl, and neopentyl. n is a number of 1500 to 3000. The copolymer has a transparency greater than 80%, a thermal resistance greater than 100&#xb0; C., a moisture absorption less than 0.5 wt %, and yellowing under UV/climate resistance greater than 1000 hours.

Copolymer and method for manufacturing the same and packaging material utilizing the same

Disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bond monomer, and 0.1 to 70 parts by weight of a bulky monomer. The copolymer has transparency greater than 90%, thermal resistance greater than 130&#xb0; C., and moisture absorption less than 0.5 wt %, such that the copolymer may be applied as packaging material for a light emitting device.

Method for packaging light-emitting diode

Growing community of inventors

Tainan County, Taiwan

Ya-Lan Chuang