Taiwan Semiconductor Manufacturing Comp. Ltd.

Ya-Hsin Tseng

Ren-Hao Jheng

A method for CMP is provided. The method includes the following operations. A semiconductor wafer is received. The semiconductor wafer is polished. In some embodiments, a residue is generated during polishing the semiconductor wafer and the residue attaches to a surface of a conditioning disk disposed on a dresser head. The dresser head and the conditioning disk are moved back and forth between a refuge position and a working region by the dresser arm during polishing the semiconductor wafer. The surface of the conditioning disk is scanned to remove the residue using a laser scanner when the dresser head and the conditioning disk are in refuge position.

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Hsinchu, Taiwan

Ya-Hsin Tseng