Lextar Electronics Corporation

Au Optronics Corporation

Ya-hsien Chang

Bo-Yu Ko

Chun-Wei Wang

Yu-Kai Lin

Jyh-Haur Huang

Lead frame

A circuit board assembly and a backlight module comprising the circuit board assembly are provided. The circuit board assembly has a first surface and a second surface opposite to the first surface, and further comprises at least one laminate, a first conductive wiring structure and a coating. The first conductive wiring structure is formed on the first surface. The coating is formed on the coating area of the second surface, wherein the coating can conduct heat and provide electric insulation. Thus, the circuit board assembly is adapted to outwardly conduct heat from the laminate through the second surface and to promote the heat dissipation efficiency of the circuit board assembly.

Circuit board assembly and backlight module comprising the same

The present invention relates to a light emitting diode (LED) backlight having a plurality of LED strips, in which driving current supplied to each of the plurality of LED strips is adjusted according to measured differences in chromaticity coordinates between the actual light chromaticity and brightness output by each LED strip and a desired light chromaticity and brightness of each LED so that the LED backlight generates light of a desired color with a uniform brightness, and methods of operating the same.

Color control of multi-zone LED backlight

Growing community of inventors

Hsinchu, Taiwan

Ya-hsien Chang