Kinsus Interconnect Technology Corp.

Ya-Hsiang Chen

Ting-Hao Lin

Chien-Wei Chang

Yu-Te Lu

Jun-Chung Hsu

De-Hao Lu

Chi-Ming Lin

Tso-Hung Yeh

A laminate circuit board with a multi-layer circuit structure which includes a substrate, a first circuit metal layer, a second circuit metal layer, a first nanometer plating layer, a second nanometer plating layer and a cover layer is disclosed. The first circuit metal layer is embedded in the substrate or formed on at least one surface of the substrate which is smooth. The first nanometer plating layer with a smooth surface covers the first circuit metal layer. The second nanometer plating layer is formed on the other surface of the substrate and fills up the opening in the cover layer to electrically connect the first circuit metal layer. The junction adhesion is improved by the chemical bonding between the nanometer plating layer and the cover layer/the substrate. Therefore, the circuit metal layer does not need to be roughened and the density of the circuit increases.

Laminate circuit board with a multi-layer circuit structure

A manufacturing method of a semiconductor load board is disclosed. The manufacturing method includes a first conductive layer forming step, a first patterning step, a dielectric layer forming step, a drilling step, a second conductive layer forming step, a second patterning step or a two-times patterning step, and a solder connecting step. In a second patterning step or a two-times patterning step, a solder pad is formed in the opening of the dielectric layer, wherein each solder pad has a height higher than the height of the dielectric, and the width of each solder pad is equal to or smaller than the maximum width of the opening, such that wider intervals are provided in the same area and the problems of short circuit failure and electrical interference can be reduced.

Manufacturing method of a semiconductor load board

A method for manufacturing a heat dissipation structure of a printed circuit board includes: forming a barrier layer on the dimple in the first copper plating layer; forming a nickel plating layer; removing the nickel plating layer and the barrier layer on the dimple; forming a second copper plating layer to make the total height of the first copper plating layer and the second copper plating layer in the second opening higher than that of the first copper plating layer in the first opening; filling the dimple in the second copper plating layer with an etching-resistant material; removing the second copper plating layer; removing the nickel plating layer and the etching-resistant material to make the second copper plating layer in the second opening being at the same height as the first copper plating layer in the first opening; and forming the heat dissipation structure by photolithography.

Method for manufacturing a heat dissipation structure of a printed circuit board

A method for fabricating a buried capacitor structure includes: laminating a first dielectric layer having a capacitor embedded therein with a second dielectric layer to bury the capacitor therebetween; forming a first circuit pattern on a first metal layer of the first dielectric layer and a second circuit pattern on a second metal layer of the second dielectric layer; depositing a first insulating layer and a second insulating layer on the first metal layer and the second metal layer, respectively; electrically connecting a positive electrode end and a negative electrode end of the capacitor to the second metal layer by a positive through-hole and a negative through-hole, thereby manufacturing the buried capacitor structure.

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Yulin, Taiwan

Ya-Hsiang Chen