Industrial Technology Research Institute

Ya-Chun Tu

Hsiu-Jen Lin

Chieh-Lung Lai

Jian-Shian Lin

Yi-Ping Huang

Weng-Jung Lu

A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.

Growing community of inventors

Taipei County, Taiwan

Ya-Chun Tu