Interface Optoelectronics (shenzhen) Co., Ltd.

General Interface Solution Limited

Interface Technology (chengdu) Co., Ltd.

Interface Optoelectronics (wuxi) Co., Ltd.

Intersace Optoelectronics (wuxi) Co., Ltd.

Ya-Chu Hsu

Chun-Ta Chen

Po-Lun Chen

Po-Ching Lin

Chia-Ming Fan

Ping-Hsiang Kao

Chien-Yu Huang

Chin-I Tu

Wen-You Lai

Kuo-Fung Huang

The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.

Local stretch package structure and manufacturing method thereof

A plurality of package units is on a surface of a substrate, and a driving circuit is on the surface of the substrate. Each package unit includes at least one pixel, and each pixel is provided with a plurality of light-emitting elements. The driving circuit electrically connects to the light-emitting elements and is configured to transmit a plurality of gate driving signals and a plurality of data signals to drive the plurality of light-emitting elements to emit light to display images. The driving circuit is partially in the package units and is partially between adjacent package units. The substrate and a portion of the driving circuit between adjacent package units are made to be stretchable, while the package units are not stretchable.

Display device including a stretchable driving circuit

A conductive module includes spaced conductive layers and connecting lines. Adjacent conductive layers are electrically connected by one connecting line. Each connecting line includes a contact portion and an extending portion, the contact portion is electrically connected to one conductive layer and the extending portion. The extending portion is very stretchable in effective length to render the conductive module stretchable and deformable. A projection of the contact portion on a plane where the extending portion extends is a square, a width of the extending portion is equal to a side length of the contact portion.

Conductive module and display device

A light source assembly, a method for making same, and a display device using same are disclosed. The light source assembly includes a circuit substrate, an opaque and light-reflecting colloidal layer on the circuit substrate, micro light-emitting elements electrically connected to the circuit substrate, a base layer, a layer of convex lenses, and a layer of immediately-adjacent concave lenses. The colloidal layer defines grooves. At least two micro light-emitting elements each emitting light of a different color are arranged in each groove. The base layer is infilled into each groove and covers each micro light-emitting element. Each groove is covered by a convex lens which converges the emitted light. Each concave lens, covering one convex lens, substantially corrects optical path deviations of light of different wavelengths (that is, different colors), so reducing chromatic aberrations.

Light source assembly, method for making same, and display device

A micro light-emitting diode (micro LED) display and a package method thereof are described. The micro LED display includes a substrate, various micro LED chips, and an encapsulation film. The substrate includes a wire. The micro LED chips are disposed on a surface of the substrate and are electrically connected to the wire. A light-emitting surface of each of the micro LED chips is set with at least one micro structure, and each micro structure has a top end. The encapsulation film encapsulates the micro LED chips, and covers the surface of the substrate. The top ends of the micro structures are located in a light-emitting surface of the encapsulation film.

Micro light-emitting diode display

The present invention relates to a micro light-emitting diode display panel and a method for producing the same. A backplane and a light-emitting diode display layer are subjected to a bonding process to form eutectic structures between the backplane and light-emitting diodes of the light-emitting diode display layer. Then, an adhesive bonding layer including a resin material and conducting materials is formed on a surface of the backplane, and a heating process is performed, thereby causing the conducting materials to form a plurality of metallic bridge connection structures. Therefore, a bonding between the light-emitting diode and the backplane is reinforced, and tensile strength of the micro light-emitting diode display panel is enhanced.

Growing community of inventors

Guangdong, China

Ya-Chu Hsu