Primax Electronics Ltd.

Ya-Chin Tu

Chung-Yuan Chen

Bo-An Chen

Hung-Wei Kuo

Wei-Chiang Huang

Chin-Sung Pan

Ming-Hui Yeh

A charging device with a displaying function is provided. The charging device includes a display panel and a charging circuit. The display panel includes a substrate, a conductive layer, a spacer structure and at least one light-emitting element. The conductive layer is disposed on the substrate. The conductive layer is divided into at least one first region and at least one second region. The at least one first region and the at least one second region are separated from each other through the spacer structure. The at least one light-emitting element is electrically connected with the at least one first region and the at least one second region. The charging circuit is located under the display panel.

Charging device with displaying function

A keycap structure includes a keycap body and a display module. The keycap body includes a top wall and a lateral wall. The lateral wall is extended downwardly from a periphery region of the top wall. An accommodation space is defined by the top wall and the lateral wall collaboratively. The display module is disposed within the accommodation space. The display module includes a light-transmissible circuit substrate and plural light-emitting elements. The plural light-emitting elements are installed on the light-transmissible circuit substrate and electrically connected with the light-transmissible circuit substrate. After the light beams are transmitted through the light-transmissible circuit substrate and the top wall sequentially, the light beams are outputted from the keycap body. The light beams from the plural light-emitting elements are collaboratively formed as a luminous zone. Moreover, a pattern corresponding to the luminous zone is shown on the display module.

Keycap structure

A method of packaging a semiconductor illumination module is provided. The method includes the following steps. In a step (a), a substrate is provided. The substrate is selected from one of a flexible printed circuit board, a metal core circuit board, a printed circuit board or a ceramic printed circuit board. The substrate includes a solder mask layer with an opening, and the opening has a width R. In a step (b), a light-emitting element is installed in the opening. In a step (c), an encapsulant injection device is used to inject a packaging encapsulant into the opening. In a step (d), a sealed lens structure is formed to cover the light-emitting element, wherein the sealed lens structure has a height h.

Method of packaging semiconductor illumination module

A cooling fan includes a fan base, an impeller part, a driving part, an illumination circuit board and plural light-emitting elements. The driving part includes a shaft seat, a driving circuit board and plural coils. The driving circuit board is disposed on the fan base. The plural coils are arranged between the driving circuit board and the illumination circuit board and arranged around the shaft seat. The rotating shaft of the impeller part is inserted into the shaft seat. When an electric current flows through the plural coils, the rotating shaft is rotated. The plural light-emitting elements are disposed on the illumination circuit board. When the electric current flows through the plural light-emitting elements, the plural light-emitting elements emit light beams.

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Taipei, Taiwan

Ya-Chin Tu