Chipmos Technologies Inc.

Other

Chipmos Technologies (bermuda) Ltd

Y J Lee

An-Hong Liu

Yuan-Ping Tseng

Yeong-Her Wang

S J Cheng

A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a probe head. There are bumps on the contact pads of the probe head. Continuous electroplating process can be executed after bumps (contact pads) contact electroplating solution in the electroplating tank through the openings of the blocking plate. By continuously moving the probe head according to the desired shape of probes, probes were formed by electroplating. These probes can be made into different shapes with good uniformity in elasticity and heights to increase the quality of electrical contact during wafer probing. Moreover, the process lead time and fabrication cost are saved.

Method for manufacturing probes of a probe card

A flip chip type semiconductor device for reducing signal skew includes: a chip with bonding pads, and a plurality of bumping pads on the chip. Between each bonding pad and corresponding bumping pads is connected with a metal redistribution trace covered by a passivation layer. Each metal trace has an equal trace length for reducing signal skew.

Flip-chip type semiconductor device for reducing signal skew

A wafer level packaging process for making flip-chips and integrated circuits formed are proposed. The process comprises in turn, providing a wafer, forming a protective material, bumping the wafer, removing the protective material, probing the wafer, laser repairing, and dicing the wafer. The laser repairing step is after bumping step. The protective material such as photoresist or metal layer is filled into the depression portions above the fuses for temporary protection of the fuses during bumping.

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Tainan, Taiwan

Y J Lee