Shanghai Tianma Micro-electronics Co., Ltd.

Shanghai Avic Opto Electronics Co., Ltd.

Chengdu Tianma Micro-electronics Co., Ltd.

Xuhui Peng

Kerui Xi

Feng Qin

Tingting Cui

Zhenyu Jia

Jie Zhang

Zhihua Ling

Bo Wu

Baiquan Lin

Sitao Huo

Yingru Hu

Xinghua Nie

Zhongshou Huang

Qinyi Duan

Willem Den Boer

Jine Liu

Xiaohe Li

Qiongqin Mao

Yuantao Wu

Linzhi Wang

Junting Ouyang

Zuocai Yang

Ping Su

Boquan Lin

Dongquan Hou

Mingyu Wang

A liquid crystal antenna is described. The liquid crystal antenna includes liquid crystal phase shifter units arranged in an array; a first feeding network line corresponding to an iscanning line and extending along a first direction, and/or, a second feeding network line corresponding to an jdata line and extending along a second direction. The first feeding network line is provided between the iscanning line and an (i+1)scanning line, and a scanning line protrusion protrudes toward a side facing away from the first feeding network line corresponding to the iscanning line. The second feeding network line is provided between the jdata line and a (j+1)data line, and a data line protrusion protrudes toward a side facing away from the second feeding network line corresponding to the jdata line.

Liquid crystal antenna

The present disclosure provides chip package structure, packaging method, camera module and electronic equipment. The package structure includes chip package module, which includes light-transmitting substrate, wiring layer located on side of light-transmitting substrate and including first metal wire, conductor located on side of wiring layer facing away from light-transmitting substrate, photosensitive chip located on side of wiring layer facing away from the light-transmitting substrate, active chip located on side of wiring layer facing away from light-transmitting substrate, and plastic encapsulation layer encapsulating photosensitive chip and active chip. The conductor includes first end electrically connected to first metal wire, and second end. The photosensitive chip includes pin electrically connected to first metal wire and has photosensitive surface facing towards light-transmitting substrate. The photosensitive surface includes photosensitive region that is not overlapping first metal wire. The active chip includes pin electrically connected to first metal wire.

Package structure, packaging method, camera module, and electronic equipment

A semiconductor package includes a semiconductor element, a wiring structure, an encapsulation structure, and a solder ball. The semiconductor element includes a plurality of pins. A side of the wiring structure is electrically connected to the plurality of pins of the semiconductor element. The wiring structure includes at least two first wiring layers. A first insulating layer is disposed between adjacent two first wiring layers of the at least two first wiring layers. The first insulating layer includes a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The encapsulation structure at least partially surrounds the semiconductor element. The solder ball is located on a side of the wiring structure away from the semiconductor element. The solder ball is electrically connected to the at least two first wiring layers.

Semiconductor package having a semiconductor element and a wiring structure

A chip package structure, manufacturing method thereof, and module are described. In an embodiment, the chip package structure includes: a substrate, a wiring layer, a chip, and a second conductive bump, wherein, in an embodiment, the substrate includes a first region and a second region surrounding the first region, and the wiring layer is located on side of the substrate and includes metal wire, wherein at least part of a metal wire is in contact with the substrate in direction perpendicular to the substrate, and the metal wire overlaps with the second region, wherein the chip is located on side of the wiring layer facing away from the substrate, and the chip corresponds to the first region. In an embodiment, a first conductive bump is provided on side of the chip facing away from the substrate and is electrically connected to the metal wire.

Chip package structure and method for manufacturing the same, and module

Provided are an antenna, a phase shifter, and a communication device. The antenna includes a first metal electrode, a second metal electrode, and a photo-sensitive layer. The first metal electrode and the second metal electrode are respectively located on two opposite sides of the photo-sensitive layer. The first metal electrode includes multiple transmission electrodes. The multiple transmission electrodes are configured to transmit electrical signals. The photo-sensitive layer includes at least one photo-sensitive unit and the at least one photo-sensitive unit overlaps the transmission electrodes. The antenna provides more possibilities for large-scale commercialization.

Antenna, phase shifter, and communication device

A phase shifter, a fabrication method thereof, and an antenna are provided. The phase shifter includes a first substrate, a second substrate, a ground electrode disposed on a side of the first substrate facing towards the second substrate, a transmission electrode disposed on a side of the second substrate facing towards the first substrate, and liquid crystals filled between the first substrate and the second substrate. In a direction perpendicular to a plane of the second substrate, the transmission electrode overlaps with the ground electrode. The ground electrode is provided with a detection hollow part, and in the direction perpendicular to the plane of the second substrate, at least a part of the detection hollow part does not overlap with the transmission electrode.

Phase shifter, fabrication method thereof, and antenna

Provided are a semiconductor package and a method for fabricating the semiconductor package. The method includes the followings steps: a first workpiece is provided, where the first workpiece includes a first substrate and multiple first rewiring structures arranged on the first substrate at intervals, and each first rewiring structure includes at least two first rewiring layers; an encapsulation layer is formed on the first rewiring structures, where the encapsulation layer is provided with multiple first through holes, and the first through holes expose one first rewiring layer; at least two second rewiring layers are disposed on a side of the encapsulation layer facing away from the first rewiring layer; multiple semiconductor elements are provided, where the semiconductor elements are arranged on a side of the first rewiring structures facing away from the encapsulation layer, where the first rewiring layers are electrically connected to pins of the semiconductor elements.

Semiconductor package and method for fabricating the semiconductor package

Disclosed antenna unit includes first substrate and second substrate opposite to each other, phase shifting units and driver circuit. Region facing the first substrate and the second substrate form phase shifting region. In first direction, the first substrate formed with first step region, and used for connecting radio-frequency signal terminal; in second direction, the second substrate formed with second step region, and included angle between the first direction and the second direction greater than or equal to 0&#xb0; and smaller than 180&#xb0;. At least part of the first step region does not overlap at least part of the second step region. Phase shifting units used for radiating radio-frequency signal and distributed in phase shifting region, each phase shifting unit. At least part of the driver circuit disposed in the second step region and the driver circuit electrically connected to each phase shifting unit to adjust radio-frequency signal.

Antenna unit, antenna apparatus and electronic device

A microfluidic device includes: first substrate, microfluidic channel layer, and second substrate; the first substrate includes light source layer including a plurality of light source structures, the light source structure includes first electrode, second electrode, and an electroluminescence module, and when being turned on, emits light passing through the microfluidic channel layer and irradiating the second substrate; the second substrate includes photoelectric detection layer including a plurality of photoelectric detection structures and driving electrode layer including a plurality of driving electrodes and a plurality of driving circuits, the photoelectric detection structure includes third electrode, fourth electrode, and photoelectric conversion module arranged therebetween, and when being turned on, generates an electrical signal according to an incident light signal; the driving circuit is configured to apply a voltage to each driving electrode such that a droplet moves in a microfluidic channel of the microfluidic channel layer.

Microfluidic device and detection method thereof

A semiconductor package and a method of forming the semiconductor package are provided. The method includes providing a first substrate, forming a wiring structure containing at least two first wiring layers, disposing a first insulating layer between adjacent two first wiring layers, and patterning the first insulating layer to form a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The method also includes providing at least one semiconductor element each including a plurality of pins. In addition, the method includes disposing the plurality of pins of the each semiconductor element on a side of the wiring structure away from the first substrate. Further, the method includes encapsulating the at least one semiconductor element, and placing a ball on a side of the wiring structure away from the at least one semiconductor element.

Semiconductor package having semiconductor element with pins and formation method thereof

A phase shifter and a manufacturing method thereof and an antenna and a manufacturing method thereof are provided. The phase shifter includes: first and second substrates opposite to each other; a first electrode provided on the first substrate and configured to receive a ground signal; a second electrode provided on a side of the second substrate facing towards the first substrate; liquid crystals encapsulated between the first substrate and the second substrate and driven by the first electrode and the second electrode to rotate; and a support structure provided between the first substrate and the second substrate and including a first spacer. The first spacer is located on a side of the second electrode facing away from the second substrate, and an orthographic projection of the first spacer on the second substrate is within an orthographic projection of the second electrode on the second substrate.

Phase shifter and manufacturing method thereof, antenna and manufacturing method thereof

Provided are a liquid crystal phase shifter and an antenna. The liquid crystal phase shifter includes a first substrate, a second substrate, a liquid crystal layer, and at least one phase shift unit. The first substrate includes a first flexible substrate and a first liquid crystal alignment layer located on a side of the first flexible substrate close to the second substrate. The second substrate includes a second flexible substrate and a second liquid crystal alignment layer located on a side of the second flexible substrate close to the first substrate. The phase shift unit includes a microstrip line and a phased electrode. The microstrip line is located between the first flexible substrate and the first liquid crystal alignment layer, and the phased electrode is located between the second flexible substrate and the second liquid crystal alignment layer.

Liquid crystal phase shifter including a liquid crystal layer located between first and second flexible substrates, where a third flexible substrate provides a feed portion

Provided are a semiconductor package and a method for fabricating the semiconductor package. The method includes followings steps: a first workpiece is provided, where the first workpiece includes a first substrate and multiple first rewiring structures arranged on the first substrate at intervals, and each first rewiring structure includes at least two first rewiring layers; an encapsulation layer is formed on the first rewiring structures, where the encapsulation layer is provided with multiple first through holes, and the first through holes exposes one first rewiring layer; at least two second rewiring layers are disposed on a side of the encapsulation layer facing away from the first rewiring layer; multiple semiconductor elements are provided, where the semiconductor elements are arranged on a side of the first rewiring structures facing away from the encapsulation layer, where the first rewiring layers are electrically connected to pins of the semiconductor elements.

Semiconductor package including workpiece and method for fabricating the semiconductor package

Provided is a liquid crystal phase shifting device including: a first substrate and a second substrate that are opposite to each other, wherein first protrusions is provided on a surface of the first substrate facing towards the second substrate, second protrusions is provided on a surface of the second substrate facing towards the first substrate, and the first protrusions and the second protrusions are alternately arranged; a microstrip line provided on the surface of the first substrate facing towards the second substrate, the microstrip line covering at least part of the first protrusions; first support pads provided between the first substrate and the second substrate; a ground electrode provided on the surface of the second substrate facing towards the first substrate, the ground electrode overlapping at least part of the second protrusions; and liquid crystal molecules provided between the microstrip line and the ground electrode.

Liquid crystal phase shifting device including protrusions formed therein, a manufacturing method thereof, and a phase shifter matrix formed by the phase shifting devices

Fingerprint recognition circuit, fingerprint recognition structure, fingerprint recognition device, display panel, and display device are provided. The circuit includes: a fingerprint recognition driving transistor; a first capacitor; a driving signal input terminal; and a sensing signal output terminal. The first capacitor has a terminal electrically connected to a gate of the fingerprint recognition driving transistor and another terminal electrically connected to a ground. The driving signal input terminal is electrically connected to an input terminal of the fingerprint recognition driving transistor. An output terminal of the fingerprint recognition driving transistor is electrically connected to the sensing signal output terminal.

Growing community of inventors

Shanghai, China

Xuhui Peng