Northeastern University

Xugang Xiong

Ahmed Busnaina

Sivasubramanian Somu

Nicol E McGruer

George G Adams

Peter Ryan

Taehoon Kim

Yung Joon Jung

TaeHoon Kim

Moneesh Upmanyu

Mehmet Remzi Dokmeci

Laila Jaberansari

Nishant Khanduja

Selvapraba Selvarasah

Prashanth Makaram

Chia-Ling Chen

A non-volatile bistable nano-electromechanical switch is provided for use in memory devices and microprocessors. The switch employs carbon nanotubes as the actuation element. A method has been developed for fabricating nanoswitches having one single-walled carbon nanotube as the actuator. The actuation of two different states can be achieved using the same low voltage for each state.

System and method for integrating a single nanowire into a nanocircuit

Methods for fabricating templates for nanoelement assembly and methods for fluid-guided assembly of nanoelements are provided. Templates are fabricated by plasma modification of surface hydrophilicity and production of a network of hydrophobic trenches having a hydrophilic bottom surface. Single-walled carbon nanotubes (SWNT) can be assembled into stable films, ribbons, and wires of nanoscale thickness and nanoscale or microscale width and length. The nanofilm assemblies prepared according to the invention are highly conductive and can be used in the fabrication of a wide variety of microscale and nanoscale electronic devices.

Highly organized single-walled carbon nanotube networks and method of making using template guided fluidic assembly

Method of integrating a single nanowire into a nanocircuit

An assembly of nanoelements forms a three-dimensional nanoscale circuit interconnect for use in microelectronic devices. A process for producing the circuit interconnect includes using dielectrophoresis by applying an electrical field across a gap between vertically displaced non-coplanar microelectrodes in the presence of a liquid suspension of nanoelements such as nanoparticles or single-walled carbon nanotubes to form a nanoelement bridge connecting the microelectrodes. The assembly process can be carried out at room temperature, is compatible with conventional semiconductor fabrication, and has a high yield. The current-voltage curves obtained from the nanoelement bridge demonstrate that the assembly is functional with a resistance of &#x2212;40 ohms for gold nanoparticles. The method is suitable for making high density three-dimensional circuit interconnects, vertically integrated nanosensors, and for in-line testing of manufactured conductive nanoelements.

Three dimensional nanoscale circuit interconnect and method of assembly by dielectrophoresis

Bistable nanoswitch

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Boston, MA, United States of America

Xugang Xiong