Oracle International Corporation

Oracle America, Inc.

Calient Networks, Inc.

Southern Methodist University

Axalume, Inc.

Kotura, Inc.

Other

Sun Microsystems, Inc.

Pathway Innovations and Technologies, Inc.

Calient Technologies, Inc.

Wave2wave Solution Inc.

Jenluk LLC

Xuezhe Zheng

Ashok V Krishnamoorthy

John E Cunningham

Ying Luo

Guoliang Li

Ivan Shubin

Jin Yao

Jock T Bovington

Kannan Raj

Shiyun Lin

Hiren D Thacker

Jin-Hyoung Lee

Roger Jonathan Helkey

Pranay Koka

Stevan S Djordjevic

John E Bowers

Shifu Yuan

Herbert Dewitt Schwetman, Jr

Michael Oliver McCracken

Ronald Ho

Daniel Y Lee

Dazeng Feng

Mehdi Asghari

Brian Walter O'Krafka

Gary Alan Evans

Jay Bernard Kirk

Jerome K Butler

Ruo-Hua He

James R Sechrist

Shimon Muller

Frankie Liu

Peter Hunt

Robert David Hopkins, Ii

Saman Saeedi

David Edward Welsh

Jon Lexau

Roshanak Shafiiha

Daniel C Lee

Jin Hyoung Lee

Chaoqi Zhang

Tony Walter

Dan Blumenthal

Jingqiong Xie

Jeffrey W Denq

Robert G Anderson

David K McElfresh

Ji Shen

Ola Torudbakken

Wei Qian

Charles Matthew Corbalis

Yeshaiahu Fainman

Shirong Liao

James R Adleman

Philip Amberg

Eric Y Chang

Leick D Robinson

Chandrasekhar Pusarla

Gary L Gilbert

Adrian Keating

Patrick J Decker

Amnon Segal

Yonatan Silberman

Weimin Wang

Olivier Jerphagnon

Marduke Yousepfor

Paul Wills

Bart Erwin

David Kinghorn

A linear N×N robotic fiber optic switch is described. Notably, fiber adapters for connecting the input and output fibers are arranged linearly. Moreover, each fiber adaptor is driven by a push-pull mechanism such that it can be positioned to a front, center, or back position, with which the private plane of a fiber port can be separated from the other fiber ports and fiber connection can be configured using a simple linear translation robotic pickup free of interference in a compact space. Furthermore, a large scale fabric switch comprises 3 stages of N linear N×N robotic switches connected using fiber shuffles. Each stage or all three stages can share one robot to reduce cost. Scalability to large port counts may be accomplished proportional to N, the number of ports, rather than N.

Linear N×N robotic fiber optic switch

The disclosed embodiments provide an optically switched network system. This system includes a passive optical switch with N inputs and N outputs, which can communicate different wavelengths from each of the N inputs to each of the N outputs. It also includes N end-nodes, and N pairs of optical fibers, wherein each pair connects one of the N end-nodes to one of the N inputs and one of the N outputs. The optically switched network is organized into a virtual data plane and a virtual control plane, which both communicate through the same underlying physical network. The virtual data plane provides any-to-all parallel connectivity for data transmissions among the N end-nodes. The virtual control plane is organized as a ring that serially connects the N end-nodes, wherein the ring communicates arbitration information among distributed-arbitration logic at each of the N end-nodes.

Optically switched network topology

Various embodiments of the present disclosure provide a system, device, apparatus, and method for detecting and registering contact made with a surface, by both conductive and non-conductive implements. The present disclosure comprises a first conductive layer comprising a plurality of first conductors, a second conductive layer comprising a plurality of second conductors and a plurality of third conductors, orientated substantially coplanar to the first conductive layer; and a dielectric layer disposed between the first conductive layer and the second conductive layer, the dielectric layer comprising a plurality of vias; each of the plurality of first conductors are arranged in a first pattern, each of the plurality of second conductors are arranged in a second pattern, the second pattern correlating to the space between each of the plurality of first conductors, and each of the plurality of the third conductors are substantially shaped and orientated in the first pattern.

Capacitance and conductivity dual sensing stylus-independent multitouch film

An optical source may include an optical gain chip that provides an optical signal and that is optically coupled to an SOI chip. The optical gain chip may include a reflective layer. Moreover, the SOI chip may include: a first optical waveguide, a first ring resonator that selectively optically coupled to a second optical waveguide and that performs phase modulation and filtering of the optical signal, the second optical waveguide, an amplitude modulator, and an output port. Note that the reflective layer in the optical gain chip and the amplitude modulator may define an optical cavity. Furthermore, a resonance of the first ring resonator may be aligned with a lasing wavelength, and the resonance of the first ring resonator and a resonance of the amplitude modulator may be offset from each other. Additionally, modulation of the first ring resonator and the amplitude modulator may be in-phase with each other.

Single-pass ring-modulated laser

An optical source may include an optical gain chip that provides an optical signal and that is optically coupled to an SOI chip. The optical gain chip may include a reflective layer. Moreover, the SOI chip may include: a common optical waveguide, a splitter that splits the optical signal into optical signals, a first pair of resonators that are selectively optically coupled to the common optical waveguide and that are configured to perform modulation and filtering of the optical signals, and a first bus optical waveguide that is selectively optically coupled to the first pair of resonators. Furthermore, resonance wavelengths of the resonators may be offset from each other with a (e.g., fixed) separation approximately equal or corresponding to a modulation amplitude, and a reflectivity of the first pair of resonators may be approximately independent of the modulation.

Rapidly tunable silicon modulated laser

The present invention includes an optical waveguide with a grating and a method of making the same for increasing the effectiveness of the grating. In one example, the grating is at least partially covered by a liner layer disposed on at least a portion of a grating; and a cover layer disposed on the liner layer, wherein a first material selected for the core and ridges and a second material selected for the liner layer are selected to provide a difference in the index of refraction between the first and second material that is sufficient to provide a contrast therebetween.

Enhanced coupling strength grating having a cover layer

Method of making an enhanced coupling strength grating having a cover layer

The disclosed embodiments provide an apparatus for connecting one or more optical fibers to an optoelectronic system. This apparatus includes a packaged optoelectronic module (POeM) comprising an optical connector, a silicon photonic (SiP) chip, an integrated circuit (IC) chip, at least one laser chip and a package substrate. The apparatus also includes an assembly adapter enclosing the POeM, wherein the assembly adapter includes a mechanical transfer (MT) ferrule cavity, which includes one or more coarse-alignment structures to guide an MT ferrule enclosing at least one optical fiber during assembly of the apparatus. The assembly adapter is comprised of a solder-reflow-compatible material to facilitate bonding the assembly adapter to a circuit board.

Reflow-compatible optical I/O assembly adapter

A pair of optical ferrules is disclosed. Each of a first ferrule and a second ferrule of the pair may include at least one protrusion and at least one recess. Each of the protrusions or recesses may have at least one channel for holding an optical fiber. Upon mating the two ferrules, the protrusion of the first ferrule is configured to be inserted into the recess of the second ferrule and the protrusion of the second ferrule is configured to be inserted into the recess of the first ferrule such that the optical fibers held in each protrusion are optically aligned to be connected face to face with the optical fibers held in the corresponding recess of the other ferrule.

Method, apparatus and system for aligning optical transports in a ferrule

A fabrication technique for cleaving a substrate in an integrated circuit is described. During this fabrication technique, a trench is defined on a back side of a substrate. For example, the trench may be defined using photoresist and/or a mask pattern on the back side of the substrate. The trench may extend from the back side to a depth less than a thickness of the substrate. Moreover, a buried-oxide layer and a semiconductor layer may be disposed on a front side of the substrate. In particular, the substrate may be included in a silicon-on-insulator technology. By applying a force proximate to the trench, the substrate may be cleaved to define a surface, such as an optical facet. This surface may have high optical quality and may extend across the substrate, the buried-oxide layer and the semiconductor layer.

Back-side etching and cleaving of substrates

A high-power packaged laser array that is thermal reflow compatible is described. Notably, a high-power III-V laser array is integrated on a silicon substrate with a matching array of ball lenses, an isolator and a coupler (such as a reflective layer) to achieve an edge-coupled or a surface-normal output laser array. In some embodiments, an isolator with a permanent magnet is used to preserve the magnetic domain or state of the isolator during the thermal reflow(s), which can involve temperatures up to 250 C. In order to relax the misalignment tolerance when integrating with the silicon chip, a laser array with a larger optical mode may be used to increase the output beam size. Moreover, a III-V laser array with an angled output optical waveguide can be used to improve the stability of the lasers at high power.

High-power packaged laser array

The disclosed embodiments relate to the design of a hybrid laser comprising a shared ring mirror coupled to a pair of buses by a 3 dB coupler (also referred to as a 'symmetric splitter'), which is described in more detail below. Each bus is also coupled to an array of ring filters, wherein each ring filter couples an associated reflective silicon optical amplifier (RSOA) to the shared ring mirror and in doing so forms a Verniered ring pair with the shared ring mirror. The resulting system provides a comb source with redundant channels that can provide individual outputs or a shared output. This hybrid laser provides a significant improvement over existing comb-based lasers by providing redundancy for at least one laser channel.

Dense-comb redundant ring laser array

An optical transmitter includes a reflective semiconductor optical amplifier (RSOA) coupled to an input end of a first optical waveguide. An end of the first optical waveguide provides a transmitter output for the optical transmitter. Moreover, a section of the first optical waveguide between the input end and the output end is optically coupled to a ring modulator that modulates an optical signal based on an electrical input signal. A passive ring filter (or a 1&#xd7;N silicon-photonic switch and a bank of band reflectors) is connected to provide a mirror that reflects light received from the second optical waveguide back toward the RSOA to form a lasing cavity. Moreover, the ring modulator and the passive ring filter have different sizes, which causes a Vernier effect that provides a large wavelength tuning range for the lasing cavity in response to tuning the ring modulator and the passive ring filter.

Wavelength-tunable III-V/Si hybrid optical transmitter

An integrated circuit is described. This integrated circuit includes an optical waveguide defined in a semiconductor layer, and a dielectric optical waveguide disposed on the semiconductor layer and that overlaps a region of the optical waveguide. Moreover, the dielectric optical waveguide includes an optical device (such as a mirror) on a facet separating a first portion of the dielectric optical waveguide and a second portion of the dielectric optical waveguide. The facet may be at an angle relative to a plane of the dielectric optical waveguide and may include a metal layer. During operation, an optical signal conveyed by the optical waveguide is evanescent coupled to the dielectric optical waveguide. Then, the optical signal may be reflected by the optical device. For example, the angle of the facet may be 45&#xb0;, so that the optical signal is reflected normal to the plane of the dielectric optical waveguide.

Wafer-scale fabrication of vertical optical couplers

Growing community of inventors

San Diego, CA, United States of America

Xuezhe Zheng