Huawei Technologies Co., Limited

Honor Device Co., Ltd.

Xueping Guo

Le Zhang

Runqing Ye

Deliang Li

Fuqiang Ma

Shaojian Chen

Huijuan Wang

Dongyi Zhu

Hongbing Shi

Xianbo Zong

Caihua Ding

A package body includes: a substrate; a plurality of electronic components, arranged on the substrate; a package material layer, located on the substrate and packaging the plurality of electronic components; a low frequency shielding conductive structure, embedded in the package material layer, where the low frequency shielding conductive structure is located on a side of the package material layer away from the substrate and is spaced apart from the plurality of electronic components, the low frequency shielding conductive structure is provided with a plurality of through holes, an area of an opening of each of at least some of the through holes is less than 1 mm*1 mm, and a thickness of the low frequency shielding conductive structure is not less than 10 μm.

Package body, preparation method thereof, terminal, and electronic device

The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.

Wireless headset

Growing community of inventors

Shenzhen, China

Xueping Guo