Fukui Precision Component (Shenzhen) Co., Ltd.

Zhen Ding Technology Co., Ltd.

Xue-Jun Cai

Zhi-Yong Li

Chao Liu

A method for manufacturing a printed circuit board with cavity includes following steps. First, a first substrate is provided. The first substrate includes a first electrically conductive layer defining an exposed portion and a laminating portion. Second, a second substrate is provided. The second substrate includes an unwanted portion corresponding to the exposed portion and a preserving portion. Third, a first annular bump surrounding the exposed portion is formed. Fourth, a second annular bump surrounding the unwanted portion is formed. Fifth, a first adhesive layer defining an opening is provided. Sixth, the first and second substrates are laminated to the first adhesive layer, the exposed portion and the unwanted portion are exposed in the opening, and the second annular bump is in contact with the first annular bump. Seventh, the unwanted portion is removed and a cavity is defined, the exposed portion is exposed in the cavity.

Method for manufacturing printed circuit board

A method for manufacturing a multilayer PCB comprises the following steps. First, a PCB substrate includes a first circuit layer is provided. The first circuit layer includes a mounting portion. A first solder-resistant layer is formed on the mounting portion and a protective adhesive film is attached on the first solder-resistant layer. Next, a first copper foil, a first adhesive layer, a second copper foil, and a second adhesive layer are laminated on the PCB substrate, and the first and second copper foils are etched to form circuit layers. Then a cavity is defined and the protective adhesive film is exposed in it. After removing the protective adhesive film, an electronic component is mounted in the cavity. As such, a multilayer PCB with the electronic component embedded in is obtained.

Method for manufacturing multilayer printed circuit board having mounting cavity

A method for manufacturing printed circuit board includes steps below. An inner substrate including a first electrically conductive layer is provided. A first electrically conductive pattern is formed in the first electrically conductive layer. The first electrically conductive pattern includes an exposed region and an attaching region. A protective layer is formed on the entire exposed region. A first adhesive layer and a second electrically conductive layer are laminated on a surface of the first electrically conductive pattern in the attaching region and a surface of the protective layer. A slit along a boundary of the exposed region passing through the second electrically conductive pattern and the first adhesive layer is defined. The second electrically conductive layer corresponding to the exposed region, the first adhesive layer corresponding to the exposed region and the protective layer is removed.

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Shenzhen, China

Xue-Jun Cai