Intel Corporation

Microsoft Technology Licensing, LLC

Xudong Tang

David Shia

Devdatta P Kulkarni

Martha Geoghegan Peterson

Robert Jason Lankston

Chadd Nathaniel Garton

David William Mayer

Berhanu Wondimu

Examples described herein relate to a sub-assembly for a fluid cooling system and the sub-assembly can include a fluid inlet, a fluid outlet, and at least one tube that is shaped to conform to surfaces of opposing dual inline memory modules (DIMMs). In some examples, the at least one tube is to connect to the fluid inlet and the fluid outlet. In some examples, the at least one tube includes a heat transferring material. In some examples, the DIMM includes memory devices and regions between memory devices. In some examples, the at least one tube is shaped with recesses to receive memory devices and shaped with protrusions to fit within the regions. In some examples, the at least one tube is formed as a re-shaped tube by shaping of a tube. In some examples, the re-shaped tube is formed by application of pressure within the tube and/or a vacuum external to the tube.

Conformable cold plate for fluid cooling applications

A quick disconnect system includes a housing and a first connector of a quick disconnect configured to complementarily mate with a second connector of the quick disconnect. A pre-loaded biasing element is configured to provide a biasing force between the first connector and the housing. A method for mating a quick disconnect is also described. The method includes receiving a connecting force to mate a first connector of a quick disconnect in a housing with a second connector of the quick disconnect. When the connecting force is at least equal to or greater than a mating force value, the first connector is mated with the second connector. When the connecting force is greater than a pre-load value of a biasing element in the housing, the mated quick disconnect is moved relative to the housing while maintaining the connection of the mated quick disconnect.

Systems and methods for a floating quick disconnect in liquid cooling

Embodiments herein relate to multi-phase cooling of electronic equipment such as processors and voltage regulators in a rack computing system. In various embodiments, a cooling device may include a heat exchanger, an inlet manifold, an outlet manifold, one or more fluid conductors coupled with the heat exchange, the inlet manifold, and the outlet manifold to carry a two-phase fluid from the outlet manifold to the inlet manifold through the heat exchanger, and one or more fans to generate a flow of air against the heat exchanger. In some embodiments, the heat exchanger may be arranged in an inverted-V or an inverted-W configuration with respect to the fans. In embodiments, the cooling device may be disposed in a rack module. Other embodiments may be described and/or claimed.

Two-phase liquid-vapor computer cooling device

Growing community of inventors

Sammamish, WA, United States of America

Xudong Tang