Robert Boschgmbh

Huazhong University of Science and Technology

Xudan Liu

Xiaoyun Zang

Yong Kang

Qilin Huang

Lin Liang

Lubin Han

Maojun He

An evaluation module configured to evaluate the lifespan of a multichip module, the multichip module comprising a first substrate and multiple chips under evaluation, includes a second substrate, configured to be the same as the first substrate, and having attachment positions corresponding to the attachment positions on the first substrate, and at least one evaluation chip, configured to be the same as the multiple chips under evaluation. The number of evaluation chips is less than the number of chips under evaluation by at least one. The at least one evaluation chip is arranged at an attachment position on the second substrate, such that the at least one evaluation chip and the chip under evaluation arranged at the corresponding attachment position on the multichip module have the same cooling performance and sustain the same thermal stress. The present disclosure also discloses a method for evaluating the lifespan of a multichip module.

Evaluation module and evaluation method for evaluating multichip module lifespan

An integrated electric drive system includes an electric machine having a first housing and an output shaft, a transmission having a second housing and a drive shaft, and a power electronics module with a third housing and an electronic device configured to provide electric power for the electric machine. The transmission receives an input torque of the output shaft and outputs the same via the drive shaft. The power electronics module is configured to be arranged around the drive shaft. The integrated electric drive system can be installed on an electric vehicle. The integrated electric drive system has a more compact structure with a higher degree of integration, and better heat dissipation capability, facilitating spatial optimization and lightweight design of the electric vehicle.

Integrated electric drive system and electric vehicle

Growing community of inventors

Shanghai, China

Xudan Liu