Siemens Medical Solutions USA, Inc.

Xuanming Lu

Paul Anthony Wagner

Stefan Stegmeier

Christopher M W Daft

An ultrasound transducer array is formed with stealth dicing. A laser is used to form defects within the piezoelectric substrate and along the desired kerf locations. The substrate is fractured along the defects. A controlled expansion, such as using thermal expansion, may be used to establish the desired kerf width. Spacers may be used to maintain the desired kerf width. The kerfs are filled to create the ultrasound transducer array.

Method for forming an ultrasound transducer array

A CMUT or other semiconductor-based transducer is stacked with a piezoelectric transducer (PZT). The CMUT is sufficiently thin to avoid or limit interference with sound propagation through the CMUT from or to the PZT or crosstalk between transmitter elements. The PZT/CMUT layered structure is used as a matrix array, such as an array with a multi-dimensional arrangement of elements. The CMUT array is formed and thinned using semiconductor processing. The PZT transmits acoustic energy through the thin CMUT. The CMUT receives responsive echoes. Using integrated electronics in the thin wafer of the CMUT limits interconnection problems for the matrix receive array.

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Issaquah, WA, United States of America

Xuanming Lu