Siemens Medical Solutions USA, Inc.

Xuan-ming Lu

David A Petersen

Walter Petersen

Jerry D Hopple

Terry E Simpson

An interconnect is provided for a multidimensional transducer array. An adaptor provides a 90-degrees or other non-zero angle transition of conductors from connection with the elements to connection with a printed circuit board. The adaptor is formed as a component that may surface mount on the printed circuit board and may provide a pitch change from the element pitch to a different pitch, such as a pitch of conductors of an integrated circuit also mounted to the printed circuit board. The adaptor allows stacking of modules where each module uses standardized or regular printed circuit board connections.

Modular assembly for multidimensional transducer arrays

Volume scanning along different planes is provided using angling of the elements. Rather than orthogonal dicing of the slab, kerfs are formed at non-parallel and non-perpendicular angles to the azimuth axis of the array or longitudinal axis of the slab. Apertures formed from selected groups of the angled elements and/or parts of angled elements may be used to steer along planes that extend at an angle of 5 degrees or more away from the azimuth or longitudinal axis. By walking the aperture, different parallel planes are scanned with a one-dimensional array of elements.

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Issaquah, WA, United States of America

Xuan-ming Lu