Semiconductor Manufacturing International (shanghai) Corporation

Semiconductor Manufacturing International (beijing) Corporation

Other

Autodesk, Inc.

Adaptix Limited

Semiconductor Manufacturing International Corp.

Xuan Li

Qiang Wu

Wei Xiong

Guanbin Xing

Tao Song

Manyuan Shen

Yi Sun

Zhi Gang Yang

Xiaoyu Chen

Song Bai

Leslie Scott Ruskin

Ling Zhi Zhao

Fu Guo Lu

Qi Liang Ma

Fan Mei

Xiao Bing Wang

The invention relates to a polymer having a main chain which is obtained by free radical emulsion polymerisation of a monomer mixture, which comprises at least one optionally substituted styrene, at least one C1-C4 alkyl (meth)acrylate and at least one ethylenically unsaturated monomer. The monomer mixture is polymerised in a reaction mixture comprising a natural and/or synthetic polymeric stabilizer. According to the invention the polymer main chain further comprises a reaction product of silica sol and an unsaturated organosilicon compound. The invention relates also to methods of making such polymer.

Polymer and methods for manufacturing it

A semiconductor structure and its fabrication method are provided in the present disclosure. The method includes providing a layer to-be-etched, including first regions and second regions. The method further includes forming a plurality of discrete first sacrificial layers on the layer to-be-etched, where a plurality of openings is between the plurality of first sacrificial layers and includes first openings on the first regions. The method further includes forming initial sidewall spacer structures on sidewalls of the plurality of first sacrificial layers, where the initial sidewall spacer structures include first sidewall spacers, and the first sidewall spacers fill the first openings. The method further includes, using the first sidewall spacers as an alignment mark, forming a first mask layer on the layer to-be-etched and the initial sidewall spacer structures, where the first mask layer exposes a portion of the layer to-be-etched and a portion of the initial sidewall spacer structures.

Method of manufacturing a semiconductor structure by forming a mask layer using side wall spacers as an alignment mark

A substrate surface defect detection device includes an optical waveguide for receiving first light and directing the received first light to a surface of a to be tested substrate, the optical waveguide having a first surface facing toward the substrate and a second surface facing away from the substrate, a microlens array disposed on the second surface of the optical waveguide, the microlens array including a plurality of microlenses arranged in an array for receiving second light from the surface of the to be tested substrate and converging the received second light to converged light, and an imaging component for receiving the converged light from the at least one microlens array for optical imaging. The substrate surface defect detection device requires significantly less time than conventional substrate surface defect detection devices.

Defect inspection method and apparatus using micro lens matrix

One embodiment of the present invention sets forth a technique for connecting users based on a measure of correlation. The method involves receiving a first activity data element associated with a first user, where the first activity data element includes activity information related to a first software application, receiving a second activity data element associated with a second user, where the second activity data element includes activity information related to the first software application, and determining, via a processing unit, a measure of correlation between the first and second activity data elements. The method further involves determining, based on the measure of correlation between the first and second activity data elements, that a connection between the first user and the second user should be facilitated, and facilitating a connection between the first user and the second user.

Method and system for connecting users based on a measure of correlation

Rapid uplink synchronization is enabled by reducing a 2D search problem to two 1D search problems, which can generally be performed in less time. Advantage is taken of fact that a mobile device sends a ranging code on multiple sub-carriers. Using the assumption that adjacent sub-carriers will have approximately equivalent channel characteristics, phase ambiguity can be removed by differentially combining pairs of adjacent sub-carriers. Once the phase ambiguity is removed, the code, timing, and power level may be determined relatively quickly. In one embodiment, the values of correlations between received signals and possible codes are compared with a threshold.

Systems and methods for rapid uplink air interface synchronization

Growing community of inventors

Shanghai, China

Xuan Li