Sunpower Corporation

Xiuwen Tu

Seung Bum Rim

Michael C Johnson

David Aitan Soltz

Taiqing Qiu

David D Smith

Yu-Chen Shen

Kieran Mark Tracy

Junbo Wu

Michael J Defensor

Gabriel Harley

Taeseok Kim

Richard Hamilton Sewell

Thomas Pass

Michael Cudzinovic

Joseph Frederick Behnke

Xi Zhu

David F J Kavulak

Ryan Manuel Lacerda

Richard Sewell Hamilton

Yoann Buratti

A method of high reverse current burn-in of solar cells and a solar cell with a burned-in bypass diode are described herein. In one embodiment, high reverse current burn-in of a solar cell with a tunnel oxide layer induces low breakdown voltage in the solar cell. Soaking a solar cell at high current can also reduce the difference in voltage of defective and non-defective areas of the cell.

High current burn-in of solar cells

Methods of testing a semiconductor, and semiconductor testing apparatus, are described. In an example, a method for testing a semiconductor can include applying light on the semiconductor to induce photonic degradation. The method can also include receiving a photoluminescence measurement induced from the applied light from the semiconductor and monitoring the photonic degradation of the semiconductor from the photoluminescence measurement.

Photonic degradation monitoring for semiconductor devices

High throughput systems for photovoltaic UV degradation testing of solar cells, and methods of testing for UV degradation of solar cell during manufacture, are described herein. In an example, a high throughput solar cell testing apparatus includes a plurality of real time ultra-violet (RTUV) testing modules. Each of the RTUV testing modules includes an ultra-violet (UV) light source, an optics assembly for focusing light from the UV light source on a sample area, and a detector for receiving photoluminescence energy from the sample area. The high throughput solar cell testing apparatus also includes an acquisition and control assembly coupled to the plurality of RTUV testing modules.

High throughput system for photovoltaic UV degradation testing

An adhesive may be applied to a surface of a reusable carrier. Metal foil may be attached to the adhesive to couple the metal foil to the surface of the reusable carrier. The metal foil may be patterned without damaging the reusable carrier. A semiconductor structure (e.g., a solar cell) may be attached to the patterned metal foil. The reusable carrier may then be removed. In some embodiments, the semiconductor structure may be encapsulated using an encapsulant, with the adhesive being compatible with the encapsulant.

Patterned thin foil

Forming a metal layer on a solar cell. Forming a metal layer can include placing a patterned metal foil on the solar cell, where the patterned metal foil includes a positive busbar, a negative busbar, a positive contact finger extending from the positive busbar, a negative contact finger extending from the negative busbar, and a metal strip, and one or more tabs. The positive and negative busbars and the positive and negative contact fingers can be connected to one another by the metal strip and tabs. Forming the metal layer can further include coupling the patterned metal foil to the solar cell and removing the metal strip and tabs. Removing the metal strip and tabs can separate the positive and negative busbars and contact fingers.

Alignment for metallization

Enhanced adhesion of seed layers for solar cell conductive contacts and methods of forming solar cell conductive contacts are described. For example, a method of fabricating a solar cell includes forming an adhesion layer above an emitter region of a substrate. A metal seed paste layer is formed on the adhesion layer. The metal seed paste layer and the adhesion layer are annealed to form a conductive layer in contact with the emitter region of the substrate. A conductive contact for the solar cell is formed from the conductive layer.

Enhanced adhesion of seed layer for solar cell conductive contact

Forming a metal layer on a solar cell. Forming a metal layer can include placing a patterned metal foil on the solar cell, where the patterned metal foil includes a positive busbar, a negative busbar, a positive contact finger extending from the positive busbar, a negative contact finger extending from the negative busbar, a metal strip, and one or more tabs. The positive and negative busbars and the positive and negative contact fingers can be connected to one another by the metal strip and tabs. Forming the metal layer can further include coupling the patterned metal foil to the solar cell and removing the metal strip and tabs. Removing the metal strip and tabs can separate the positive and negative busbars and contact fingers.

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San Jose, CA, United States of America

Xiuwen Tu