National Starch and Chemical Investment Holding Corporation

Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Xiping He

Qili Wu

Christopher J Dominic

Li Yao

Chenyu Huang

Torey Tomaso

Lily Yan

Laura Yao

The present invention relates to a conductive compositions for low frequency EMI shielding. An EMI shielding composition according to the present invention comprises a resin comprising a thermoplastic resin and/or a thermoset resin, a solvent and/or a reactive diluent and particles, wherein said particles comprise a mixture of magnetic particles and electrically conductive particles or magnetic particles coated with electrically conductive material or a mixture of magnetic particles coated with electrically conductive material and electrically conductive particles and wherein, said composition comprises &#x2265;10% magnetic particles by weight, by total weight of the composition. The EMI shielding composition according to the present invention has good electrical and magnetic conductivity and is suitable as a drop-in solution for EMI shielding in a wide frequency range, and especially at low frequency ranges.

Conductive composition for low frequency EMI shielding

A sprayable adhesive composition having a viscosity within the range of 0.5 Pa.s to 5.0 Pa.s, containing at least one colored filler present in an amount up to 50% by weight of the adhesive composition, is suitable for marking identifications or fiducials on semiconductor dies or wafers. The preferred resins include epoxy resins or combinations of an electron donor resin and an electron acceptor resin.

Sprayable adhesive material for laser marking semiconductor wafers and dies

Fabrication of a CSP or a stacked chip CSP can be accomplished with an unsupported film adhesive or an adhesive supported on a rigid carrier, using standard die attach equipment constructed for use with a paste adhesive.

Adhesive wafers for die attach application

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Cerritos, CA, United States of America

Xiping He