Qualcomm Incorporated

Xiongfei Meng

Yuancheng Christopher Pan

Joon Hyung Chung

An apparatus including a conductive stack structure includes an Mlayer interconnect on an Mlayer and extending in a first direction on a first track, an Mlayer interconnect on an Mlayer in which the Mlayer is a lower layer than the Mlayer, a first via stack coupled between the Mlayer interconnect and the Mlayer interconnect, a second via stack coupled between the Mlayer interconnect and the Mlayer interconnect, a second Mlayer interconnect extending in the first direction on a track immediately adjacent to the first track, and a third Mlayer interconnect extending in the first direction on a track immediately adjacent to the first track. The Mlayer interconnect is between the second Mlayer interconnect and the third Mlayer interconnect. The second Mlayer interconnect and the third Mlayer interconnect are uncoupled to each other.

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Carlsbad, CA, United States of America

Xiongfei Meng