Texas Instruments Corporation

Xinyu Yin

Liang Zhang

Danyang Zhu

Zhuang Ma

Abha Singh Kasper

Michael Dean Shilhanek

Yutao Wang

Pengyu Guo

Steven Bolen

Albert Eardley

A circuit includes a current compensation circuit having first and second compensation inputs, and a compensation output. The first compensation input is coupled to an input voltage terminal and the second compensation input is coupled to a switching terminal. The circuit further includes a one-shot circuit having a comparator having first and second comparator inputs, and a comparator output. The first comparator input is coupled to a voltage reference terminal and the second comparator input is coupled to the compensation output. The one-shot circuit further includes a switch coupled between the second comparator input and a ground terminal and a capacitor having first and second capacitor terminals, in which the first capacitor terminal is coupled to the second comparator input and the second capacitor terminal is coupled to the ground terminal.

One-shot circuit with current compensation

A multichip module (MCM) device include a first die including functional circuitry bonded by a plurality of inter-die bond wires (bond wires) to a second die having functional circuitry. A first channel (Channel A) and second channel (Channel B) each have separate top and bottom signal paths (signal paths) including one of the bond wires. A failure of any of the signal paths does not affect functionality of the device. The first die includes input pins including a first input pin (P), a second input pin (P), and coupling circuitry including cross-channel test circuitry positioned between the input pins and the functional circuitry. The coupling circuitry provides for Channel A and Channel B a first configuration for normal mode operation and a second configuration for test mode operation for single bond wire testing for checking continuity of any of the bond wires.

Multi-channel MCM with test circuitry for inter-die bond wire checking

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Xinyu Yin