Other

Boe Technology Group Co., Ltd.

Beijing Boe Display Technology Co., Ltd.

Hu, Xinyu

Xinyu Hu

Zhiming Meng

Yunfei Wang

Luqiang Guo

Liwei Zhu

Ming Hua

Xijun Hu

The present application provides a turn-on voltage supplying circuit and method, a defect analysis method and a display device. The turn-on voltage supplying circuit includes a voltage supplying unit and a switching unit. The voltage supplying unit is configured to provide turn-on voltages, values of which being within a predetermined range, to the M stages of gate driving circuits respectively in the case that the M stages of gate driving circuits are in a normal operation state, or provide corresponding turn-on voltages to the gate driving circuits in the case that the gate driving circuits are subject to a defect analysis process. M is an integer greater than 1. When the gate driving circuits are subject to the defect analysis process, the voltage supplying unit comprises variable resistors connected between a reference turn-on voltage outputting terminal and the turn-on voltage inputting terminals of the gate driving circuits.

Turn-on voltage supplying circuit and method, defect analyzing method and display device

A powder particle shaping device includes a closed cavity capable of changing between multiple shapes as an external pressure changes, and the closed cavity compresses and moves powder particles with which the closed cavity is filled full while the shape changes. A powder particle shaping method is further provided, which includes a. filling a cavity full with powder particles to be shaped; and b. applying a varying external pressure to make the cavity change repeatedly between multiple shapes, thereby making the powder particles under compression move and be subject to friction, where the cavity is kept in a closed state during an effective processing process. The shaping device and method have highly controllable shaping processing intensity of powder particles and stable processing strength, and thus are applicable to shaping and pulverization of various powder particles, and also applicable to pulverization and further shaping processing of dispersed agglomerates.

Powder particle shaping device and method

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Beijing, China

Xinyu Hu