Hisense Laser Display Co., Ltd.

Hisense USA Corporation

Hisense International Co., Ltd.

Hisense Co., Ltd.

Qingdao Hisense Laser Display Co., Ltd.

Xintuan Tian

Changming Yang

Yun Zhao

Zhe Xing

Lei Cui

Boyu Zhou

Wei Li

Youliang Tian

Naiwen Hou

Jian Zhang

Jianjun Li

Yongda Huang

Longfei Shi

Haijun Yin

Wenbang Cai

A laser device is provided. The laser device includes a case, a plurality of light-emitting assemblies, an upper cover assembly and a stress-offsetting structure. The case includes a bottom plate and a frame body. The frame body is disposed on the bottom plate, and is enclosed on the bottom plate to form an accommodating space with an opening. The plurality of light-emitting assemblies is located in the accommodating space and are disposed on the bottom plate. The upper cover assembly is fixed to the case and covers the opening. The stress-offsetting structure is disposed in the frame body and/or in the upper cover assembly, and is configured to be contracted in a squeezing direction when the stress-offsetting structure is squeezed.

Laser device and laser projection apparatus

A laser source includes a laser source housing, a laser array and a beam path assembly. The laser source housing includes an accommodating opening and a beam outlet. The laser array is disposed in the accommodating opening. The laser array is configured to emit laser beams into the laser source housing. A laser-exit surface of the laser array includes a plurality of laser-exit regions. The plurality of laser-exit regions are configured to emit laser beams of multiple colors. The beam path assembly is disposed inside the laser source housing. The beam path assembly is configured to combine the laser beams of the multiple colors emitted by the laser array, and make the combined laser beams exit toward the beam outlet.

Laser source and laser projection apparatus

A laser projector includes a laser assembly, a beam combination mirror group and a phase delaying component. The laser assembly includes a red laser light emitting region, a blue laser light emitting region and a green laser light emitting region. Red laser light is polarized in a first direction, green laser light is polarized in a second direction, and blue laser light is polarized in a third direction. The beam combination mirror group combines the red laser light, the blue laser light and the green laser light. The phase delaying component is on a light emitting path of at least one of the red laser light, the blue laser light the green laser light, and changes a polarization direction of the at least one of the red laser light, the blue laser light or the green laser light before being output by the beam combination mirror group.

Laser projector

Embodiments of the present application provide a laser light source and a laser projection device. The laser light source includes a laser assembly and a light combination mirror assembly. The laser assembly includes at least a laser, a light emitting surface of the laser has a plurality of light emitting regions, and beams emitted from different ones of the plurality of light emitting regions are in different colors. The light combination mirror assembly includes a plurality of mirrors that are sequentially arranged along an optical transmission path of the laser, with each of the mirrors corresponding to one of the light emitting regions. The light combination mirror assembly is used to converge the beams in different colors emitted from the laser to form a white beam.

Laser light source and laser projection device

A projector includes a shell, a light source, an optical machine, a projection lens and an auxiliary positioning device. The light source is configured to provide illumination beams. The optical engine is configured to modulate the illumination beams based on received image signals to obtain projection beams. The projection lens is configured to project the projection beams on a projection plane for imaging. The auxiliary positioning device is connected to the shell and is configured to locate a position the projector. The auxiliary positioning device includes a positioning rod which includes a first end and a second end opposite to the first end; the first end of the positioning rod is connected to the shell, and the second end of the positioning rod is configured to abut against a reference object that is at a fixed position relative to the projection plane.

Projector

Embodiments of the present application provide a laser light source and a laser projection device. The laser light source includes a laser assembly, where the laser assembly includes a laser and a circuit board, the laser includes a substrate and a light emitting chip arranged on the substrate, a lateral surface of the substrate is provided with a plurality of pins extending outwards therefrom, the circuit board is arranged on a side where the pins extend, and the circuit board is electrically connected to the pins. The laser light source of the present application features simple assembling and disassembling, reliable performance and relatively low cost.

An laser projection apparatus includes: a laser projection apparatus housing, a laser source system disposed in the apparatus housing, and the laser source system including a first laser outlet, an optical engine disposed in the apparatus housing, and the optical engine including a second laser inlet and a third laser outlet, and the second laser inlet being connected to the first laser outlet; a lens system disposed in the apparatus housing, and one end of the lens system extending to the third laser outlet; and at least one circuit board. The lens system and the optical engine are disposed along a first direction of the apparatus housing to divide space in the apparatus housing into a first region and a second region.

Laser projection apparatus

A laser module includes an encapsulating support, at least one laser, a sealing gasket, and a pressing plate. Each laser includes a supporting plate and a laser body that is fixed to the supporting plate. The supporting plate is fixed on the encapsulating support, and a surface of an end of the laser body away from the supporting plate is a light exit end face. The sealing gasket is located on a surface of the supporting plate close to the light exit end face, and the sealing gasket has a first opening at a position corresponding to the laser body. A pressing plate is located on a surface of the sealing gasket away from the supporting plate; the pressing plate is fixedly connected to the encapsulating support, and the pressing plate has a second opening at a position corresponding to the first opening.

Laser module and laser projection device

The DMD assembly in present disclosure includes a base mounted on a first side of a driver board; a chip substrate; a DMD chip mounted on the chip substrate; and a fixing frame fixed with driver board on the first side; a second side of the base includes a mounting groove configured to mount the chip substrate; the fixing frame includes an insertion hole, and the base is received in the insertion hole; an elastic protrusion is positioned beside the inserting hole, and the elastic protrusion comprises a fixing portion and a pressing portion, the fixing portion is connected to the fixing frame on a side of the fixing frame facing away from the driver board, the pressing portion is positioned on the fixing portion; a surface of the pressing portion facing the chip substrate contacts the chip substrate to clamp the chip substrate against the base.

DMD assembly and DLP projection device

The present disclosure relates to the field of optical and projecting technology, and particularly to a DMD assembly, DLP optical engine and DLP projection device. The DMD assembly includes a base, a driver board, a chip substrate with a DMD chip and a fixing frame, where a first side of the base is provided with a mounting groove for mounting the chip substrate, a second side of the base is attached to the driver board, and the first side is opposite to the second side; a conductive spring leaf on the base extends through a bottom of the mounting groove and is beyond the second side, so that the chip substrate is electrically connected to the driver board through the conductive spring leaf; the driver board is provided with a first through hole, and the fixing frame is provided with a second through hole; position of the first hole corresponds to position of the second hole, and the driver board and the fixing frame are fixed by a fastener extending through the first through hole and the second through hole; and the fixing frame is provided with an inserting hole, into which the base is inserted.

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