Lenovo (beijing) Limited

Xintong Ding

Ting Tian

Huanhuan Xue

Puyu Yao

A heat dissipating structure includes a cold plate configured to exchange heat with a heat dissipating device; a liquid pipe disposed at both ends of the cold plate, the liquid pipe being configured to transport heat conducting liquid; and a deformation structure configured in the liquid pipe and located at a position corresponding to the cold plate, wherein the deformation structure deforms as an ambient temperature changes. The deformation structure is configured in the heat dissipating structure to manage the flow rate of the heat conducting liquid. The deformation structure deforms at different ambient temperatures. Based on a relationship between the temperature and a deformation coefficient, the flow rate of the heat conducting liquid flowing through the liquid pipe can be controlled for different temperatures. Thus, a desired heat dissipating capacity can be provided to the heat dissipating device to satisfy the needs of users.

Heat dissipating structure

A heat dissipation device includes: a rigid tube, including a first cavity; a first capillary structure, at least a portion of the first capillary structure being positioned within the first cavity; a flexible tube, including a second cavity, the flexible tube being more flexible than the rigid tube; and a second capillary structure, at least a portion of the second capillary structure being positioned within the second cavity, wherein the heat dissipation device is deformable via the flexible tube.

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Beijing, China

Xintong Ding