Huawei Technologies Co., Limited

Shenzhen Xinyichang Technology Co., Ltd

Xinrong Hu

Liang Zhang

Meng Wang

Chen Wang

Gang Huang

Ling Liu

Zhi Zhang

Yusong Chi

Min Yi

Hongyu Wang

Zhuobiao He

Jianjun Zhou

Yuan Wei

Rong Peng

Yongli Wang

Jin Rao

Xiaosheng Zhu

Xinfang Liu

Linghai Zeng

Chuxiong Yan

Guopeng Zeng

The application provides a die-bonding machine, including: a transferring unit used to support and transfer a substrate to a bonding position; a feeding unit used to position and supply the substrate to the transferring unit; a die supply unit used to support a die ring and supply dies to a die supply position; a die ring supply unit used to supply full die rings to the die supply unit and recover empty die rings in the die supply unit; a turret mechanism for transferring the dies in the die supply position to a die extraction position; a piercing mechanism for downwardly piercing a blue film of a die on the die supply position to push the die to the turret mechanism; and, and a die-bonding mechanism.

Die-bonding machine

A continuous variable gain amplifier includes an attenuator network, a boost network, a first amplifying network, and a second amplifying network, where the attenuator network generates first differential output signals according to an input signal and sends the first differential output signals to the first amplifying network and the second amplifying network; the first amplifying network and the second amplifying network receive one output of the first differential output signals each, and generate a first final output signal and a second final output signal respectively according to an externally input control voltage; and the boost network receives the first final output signal and the second final output signal, generates second differential output signals, and sends a first output and a second output of the second differential output signals to the first amplifying network and the second amplifying network, respectively.

Continuous variable gain amplifier

An equivalent radio frequency (RF) notch filter, an RF chip, and a receiver are provided. The equivalent RF notch filter includes: a local oscillation (LO) circuit, configured to provide a LO frequency signal; configured to be connected in parallel with the main chain, and down-convert signals of the main chain; and a frequency selective circuit realized by impedance difference, configured to provide different impedances for down-converted signals with different frequencies from the mixing circuit, so as to absorb the signals that need to be suppressed.

Equivalent radio frequency notch filter, radio frequency chip, and receiver

An amplifying device and a signal processing method based on an amplifying device are provided, capable of reducing performance requirements of modules and reducing design difficulty of the modules. The amplifying device includes at least one amplifying module, including two receiving paths, in which a first receiving path is configured to attenuate and amplify an input signal after the input signal is pre-amplified, and a second receiving path is configured to amplify the input signal when the input signal is not pre-amplified. The signal processing method based on the amplifying device is further provided. The amplifying device and the signal processing method may be applied in a communication network system.

Amplifying device and signal processing method based on amplifying device

Growing community of inventors

Shenzhen, China

Xinrong Hu