Henkel IP Holding Gmbh

Henkel Ag & Company, Kgaa

Xinpei Cao

Qizhuo Zhuo

Juliet Grace Sanchez

Xuan Hong

Harry Richard Kuder

Derek Wyatt

Elizabeth Hoang

Junbo Gao

Matthias Grossmann

Glenda Castaneda

Provided herein are conductive formulations which are useful for applying conductive material to a suitable substrate; the resulting coated articles have improved EMI shielding performance relative to articles coated with prior art formulations employing prior art methods. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. Specifically, invention methods utilize capillary flow to substantially fill any gaps in the coating on the surface of an electronic package. Effective EMI shielding has been demonstrated with very thin coating thickness.

Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereof

Provided herein are highly conductive compositions (having a volume resistivity no greater than 1&#xd7;10Ohms&#xb7;cm) using silver flake, powder or suspension in solvent for electromagnetic interference (EMI) applications. This high conductivity will allow the use of very thin films for EMI shielding protection, which in turn will be helpful to reduce package sizes. In some embodiments, the coating composition is applied on the device surface by suitable means, e.g., by an electrostatic spray process, air spray process, ultrasonic spray process, spin coating process, or the like.

Achieving electromagnetic interference shielding protection by deposition of highly conductive compositions

Provided herein are conductive formulations wherein graphene has been added into the metal system, thereby reducing curing shrinkage and improving flexibility, without significantly affecting the EMI shielding performance thereof. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. In certain aspects of the present invention, there are also provided articles prepared using invention formulations and methods.

Graphene-containing materials for coating and gap filling applications

A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6 g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition.

Sinterable silver flake adhesive for use in electronics

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Irvine, CA, United States of America

Xinpei Cao