Amphenol Corporation

Fci Usa, Inc.

Xingye Chen

Jason Si

Ba Pham

Sam Kocsis

A stacked I/O connector for use with a high speed, high density transceiver that generates a large amount of heat. The connector may be formed with a web-like housing into which leadframe assemblies are inserted. The web-like housing may have openings in the front, back, top and/or sides, enabling airflow through the connector with little resistance. Sidewall openings may open into a channel between the housing and a wall of cage, enabling air flowing to cool transceivers inserted into the cage to pass through the connector assembly with low resistance and high cooling efficiency. A cage for the connector may have openings selectively positioned such that air flowing through the cage to cool transceivers mated to the I/O connector may pass through the connector with low resistance, enhancing cooling efficiency. Such a connector may be used with OSFP transceivers to meet signal integrity and thermal requirements at 112 GBps and beyond.

Electrical connector with conductive member welded to conductive elements

High performance stacked connector

A high performance connector that provides heat dissipation sufficient to support operation of high power consuming QSFP-DD transceivers. The connector may be housed in a cage with a first channel to receive a transceiver. A connector port may be aligned with the first channel, and a heat transfer element comprising a compressible portion may make mechanical and thermal contact with a transceiver inside the first channel. The compressible portion may be urged to contact a transceiver by a biasing element. The heat transfer element may be thermally coupled to a heat dissipating element outside the cage. The cage may have multiple channels, and the heat transfer element may be installed in a channel between other channels, each receiving transceivers such that the heat transfer element may receive heat from multiple transceivers.

High performance electrical connector

A cage for a stacked I/O connector that provides heat dissipation sufficient to support operation of QSFP-DD transceivers with a conventionally-sized cooling fan. The cage includes a second channel, between a first and a third channel that are sized and positioned adjacent ports of a connector so as to receive two transceivers. A face of the second channel may have a pattern of openings that enables a high airflow yet blocks electromagnetic radiation that would otherwise contribute to EMI. An element, adjacent the channel that similarly has a pattern of holes enabling high airflow, may further block EMI.

Growing community of inventors

Markham, Canada

Xingye Chen