Huawei Technologies Co., Limited

Kuang-Chi Cutting Edge Technology Ltd.

Xingxing Huang

Ruopeng Liu

Zhiya Zhao

Tian Zhou

Shineng Chen

Mingjun Xing

Jinguo Huang

Kaikai Liu

The disclosure discloses a controllable wave-absorbing metamaterial including a substrate and a metamaterial unit array layer. Each conductive geometric unit includes a first hollow structure, second hollow structures, and conductive geometric structures. The second hollow structures are respectively extended from four vertices of the first hollow structure, and the conductive geometric structure is disposed between each two adjacent second hollow structures. The first end of the second hollow structure is provided with a varactor diode connected to the conductive geometric structures at both sides, the second end of the second hollow structure is provided with a fixed capacitor and a fixed resistor; the fixed capacitor is connected to the conductive geometric structure at one side, and the fixed resistor is connected to the conductive geometric structure at the other side. Therefore, active adjustment on a wave-absorption frequency band can be implemented, and power consumption is very low.

Controllable wave-absorbing metamaterial

Embodiments of the present invention disclose a heat dissipation assembly including: a cage, a TEC assembly, a mounting kit, an elastic carrier, and a heat pipe, where a window is provided in a side face of the cage, the TEC assembly is located on an outer side of the cage, and a cold side of the TEC assembly passes through the window and thermally communicates with the heat emitting device in the cage; the mounting kit is configured to mount the TEC assembly and enable the TEC assembly to move in a direction leaving or approaching the heat emitting device; and a heat absorption portion of the heat pipe is mounted on the elastic carrier, and the heat absorption portion that is of the heat pipe and that is mounted on the elastic carrier thermally communicates with a hot side of the TEC assembly.

Heat dissipation assembly and communications device

Growing community of inventors

Shenzhen, China

Xingxing Huang