Shannon Systems Ltd.

Xinglong Wang

Jiangshan Li

Xiaoyan Chen

Jia He

A solid state memory device is provided. The solid state memory device includes a housing and a solid state memory module. The housing includes a housing fastening member, a first housing member, and a second housing member, wherein the second housing member is connected to the first housing member. The solid state memory module is disposed in the housing. The first housing member includes a plurality of first wedging portions, and the second housing member includes a plurality of second wedging portions. Each first wedging portion wedges the corresponding second wedging portion in a first direction. The first housing member further includes a first fastening portion, and the second housing member further includes a second fastening portion. The housing fastening member affixes the first fastening portion to the second fastening portion in a second direction, wherein the first direction differs from the second direction.

Solid state memory device

A memory device is provided. The memory device includes a motherboard, a controller, a first memory unit, a second memory unit and a heat sink. The motherboard includes a contact portion. The controller is disposed on the motherboard and corresponds to the contact portion. The first memory unit is coupled to the motherboard. The first memory unit is located on one side of the controller. The first memory unit includes a plurality of first memory chips. The second memory unit is coupled to the motherboard. The second memory unit is located on another side of the controller. The second memory unit includes a plurality of second memory chips. The heat sink is thermally connected to the controller. The heat sink is located between the first memory unit and the second memory unit.

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Shanghai, China

Xinglong Wang