Advanced Micro-Fabrication Equipment Inc. China

Advanced Micro-Fabrication Equipment, Inc.

Xingjian Chen

Tuqiang Q Ni

Rason Zuo

Sheng Guo

Xiang Sun

Shenjian Liu

Dee Wu

Lei Wan

Tuqiang Ni

Yu Guan

Ruoxin Du

Zengdi Lian

Kuan Yang

Guangwei Fan

Hongqing Wang

Jiao Duan

Disclosed is a plasma treatment apparatus, a lower electrode assembly and a forming method thereof, wherein the lower electrode assembly includes: a base for carrying a substrate to be treated; a focus ring encircling a periphery of the base; a coupling loop disposed below the focus ring; a conductive layer disposed in the coupling loop; and a wire for electrically connecting the conductive layer and the base so that the base and the conducting layer are equipotential. The lower electrode assembly is less prone to cause arc discharge.

Plasma treatment apparatus, lower electrode assembly and forming method thereof

Disclosed are a method of forming a plasma coating on a component, an apparatus for forming the coating, a component, and a processing apparatus; the apparatus for forming the coating includes: a vacuum chamber; a first coating material source, a second coating material source, and a component, which are disposed in the vacuum chamber; wherein the first coating material source includes oxygen atoms and yttrium atoms, and the second coating material source includes one of yttrium fluoride, aluminum-oxygen compound, or zirconium-oxygen compound; a first exciting device configured for exciting out the yttrium atoms and oxygen atoms from within the first coating material source; a second exciting device configured for exciting out atoms from within the second coating material source; wherein collision of the yttrium atoms and oxygen atoms excited out of the first coating material source and the atoms excited out of the second coating material source produces a chemical reaction to form on the component a plasma resistant coating including a stable phase of yttrium-based multi-element metal oxide or yttrium-based oxyfluoride. The coating formed using the apparatus has a strong plasma corrosion resistance property.

Method and apparatus for forming a plasma resistant coating, component, and plasma processing apparatus

Embodiments of the present disclosure disclose a plasma process apparatus with low particle contamination and a method of operating the same, wherein the plasma process apparatus comprises a chamber body and a liner, wherein a dielectric window is provided above the liner; the chamber body, the liner, and the dielectric window enclose a reaction space; a base for placing a wafer is provided at a bottom portion inside the reaction space; a vacuum pump device for pumping a gas out of the reaction space and maintaining a low pressure therein is provided below the base; a shutter for shuttering between an opening on a chamber body sidewall and an opening on a liner sidewall is provided inside the chamber body, for blocking contamination particles in the gas from flowing from a transfer module to the reaction space; a groove is provided at a lower portion of the liner, wherein a flowing space enclosed by a liner outer wall below the shutter and a chamber body inner wall is in communication with an inner space of the liner via the groove to form a gas flow path, such that the contamination particles entering the flowing space are pumped away by the vacuum pump device via the gas flow path. The present disclosure may not only keep the current wafer free from being contaminated, but also may reduce contamination for a next wafer transfer; besides, it enables introduction of clean air to make the contamination particles carried out of the reaction space with a more significant effect and a higher efficiency.

Plasma process apparatus with low particle contamination and method of operating the same

Disclosed is a corrosion-resistant structure for a gas delivery system in a plasma processing apparatus. By providing a plating layer of corrosion-resistant material at the parts including the gas channel to avoid reacting with the delivered corrosive gas, metal and particle contaminations are reduced. By reversely mounting nozzles such that they reliably cover the plating layer inside the gas outlet holes, the disclosure prevents the corrosion-resistant material from being damaged by the plasma generated inside the cavity. By forming a corrosion-resistant yttrium oxide coating at the surfaces of the nozzles exposed to the cavity, the disclosure prevents the plasma from eroding the nozzles. The disclosure further leverages a flexible corrosion-resistant material, such as Teflon, to the sealing surfaces of the liner in contact with the dielectric window and the cavity, which improves the overall sealing effect of the liner. The disclosure may effectively enhance the corrosion-resistant and sealing properties of the liner and prolong its service life, as well as improving operating stability of the plasma processing apparatus.

Corrosion-resistant structure for a gas delivery system in a plasma processing apparatus

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Shanghai, China

Xingjian Chen