Shanghai Tianma Micro-electronics Co., Ltd.

Xingda Xia

Jujian Fu

Gang Liu

Nana Xiong

Yuqi Hu

Tianyi Wu

Liang Xing

Junhui Lou

Shaorong Yu

Yinghua Mo

Zeshang He

A display panel includes a pixel circuit that includes a light emitting module, a driving module, a first dual control module, and a second dual control module. A control end of the driving module is connected to a first node. The first dual control module has a control end connected to a first scanning line and has a first end connected to the first node. A first capacitor is formed between an intermediate node of the first dual control module and a first potential line. The second dual control module has a first end connected to the first node and has a second end connected to the driving module. A second capacitor is formed between an intermediate node of the second dual control module and a second potential line. Capacitance of one of the first capacitor and the second capacitor is greater than another.

Display panel and display device

Provided are a display panel, a display device and a method for manufacturing a display panel. The display panel includes a display area including a first display area and a second display area. The second display area is multiplexed as a sensor reserved area. The second display area includes a light transmitting area and a light emitting area. The first display area is provided with a plurality of organic light emitting units. The light emitting area of the second display area is provided with a plurality of Micro LEDs. The second display area is further provided with a wall structures disposed in gaps between the plurality of Micro LEDs and the plurality of organic light emitting units and gaps between adjacent ones of the plurality of Micro LEDs.

Display panel, display device and a method for manufacturing a display panel

A Micro LED display substrate, a method for manufacturing the Micro LED display substrate, and a Micro LED display device are provided. In the method, the Micro LED is transferred onto the organic layer of the array substrate, one etching is performed to form through hole on both the protective layer and the array substrate, and then one metal deposition is performed to simultaneously form an electrode of the Micro LED and a structure electrically connecting the graphene layer with the source or drain electrode of the thin film transistor. Compared with the related art in which the electrode of the Micro LED and the structure electrically connecting the graphene layer with the source or drain electrode of the thin film transistor are formed through two etchings and two metal depositions, the method provided by the present disclosure saves the process steps, simplifies the process and reduces the costs.

Micro LED display substrate, method for manufacturing the same, and display device

Provided is a transfer printing substrate and a method for producing the same, in order to improve yield of picking up of the micro-components and further improve quality of image display. The transfer printing substrate includes a carrying substrate, a plurality of supporting structures, and a plurality of micro-components corresponding to the plurality of support structures in one-to-one correspondence, wherein each of the plurality of supporting structures includes a fixing part and a suspended supporting part, wherein an end of the fixing part is fixed on the carrying substrate, an end of the suspended supporting part is connected to the fixing part, the other end of the suspended supporting part supports a corresponding one of the plurality of micro-components, and a first moving space is provided between the suspended supporting part and the carrying substrate. The transfer printing substrate is used for transferring the micro-components.

Transfer printing substrate and method for producing the same

A display panel is provided. The display panel includes a display region and a non-display region. The display region includes a first substrate, containing an N-type semiconductor layer including a plurality of protrusions and a plurality of light-emitting diodes. Each light-emitting diode includes an island-shaped structure. The island-shaped structure includes a protrusion, a light-emitting layer, and a P-type semiconductor layer. The display region also includes an N electrode and a plurality of P electrodes. The N electrode has a mesh structure, and the island-shaped structure is disposed in a mesh opening of the mesh structure. The N electrode is electrically connected to the N-type semiconductor layer. The plurality of P electrodes are disposed, in a one-to-one correspondence with the plurality of light-emitting diodes, on a side opposite to the N-type semiconductor layer. Each P electrode is electrically connected to the P-type semiconductor layer.

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Shanghai, China

Xingda Xia