Rambus Inc.

Apple Inc.

Xingchao C Yuan

Mark A Horowitz

Haw-Jyh Liaw

Belgacem Haba

David Nguyen

Thomas Francis Fox

Richard E Warmke

Sayeh Khalili

Cheung-Wei Lam

Jon F Housour

Mahmoud N Mahmoud

Qianyi Zhao

Hao Shi

Gary Chung

Ali Foudazi

Le Wang

Kedi Zhang

Jung-Hoon Chun

Robert E Jeter

Rakesh L Notani

Kai Lun Hsiung

Miodrag Scepanovic

Jeffrey Nathan Gleason

Ryan J Dunn

Ralf M Schmitt

Linsen Bie

Xi Guo

Devices for mitigating or stopping noise or surface current on a display are provided. An electronic device including a display may include a display substrate, a mid-support plate that is adjacent to the display substrate, and a lower support plate that is adjacent to the mid-support plate. A space exists between the mid-support plate and the lower support plate. The mid-support plate includes one or more electromagnetic band gap (EBG) structures formed through the mid-support plate, one or more electromagnetic band gap structures mounted onto the mid-support plate, or both. The one or more electromagnetic band gap structures may mitigate or stop surface current flow across the display.

Electromagnetic band gap structures

A technique for determining performance characteristics of electronic devices and systems is disclosed. In one embodiment, the technique is realized by measuring a first response on a first transmission line from a single pulse transmitted on the first transmission line, and then measuring a second response on the first transmission line from a single pulse transmitted on at least one second transmission line, wherein the at least one second transmission line is substantially adjacent to the first transmission line. The worst case bit sequences for transmission on the first transmission line and the at least one second transmission line are then determined based upon the first response and the second response for determining performance characteristics associated with the first transmission line.

Technique for determining performance characteristics of electronic devices and systems

An electrically activated lens filter with an electro-optic portion having a radially and circumferentially symmetric electric field gradient is disclosed. More particularly, embodiments of the lens filter include an electro-optic portion having one or more conductive plugs arranged around a center region such that an electric field within the electro-optic portion varies from a maximum at an outer rim to a minimum outside of the center region. The lens filter may include a plurality of front electrodes and rear electrodes accessible in an axial direction for electrically activating front and rear transparent conductive layers, respectively.

Camera lens filter

A method and apparatus for memory calibration averaging is disclosed. In one embodiment, a memory subsystem includes a memory and a memory controller. The memory controller includes a calibration control circuit that periodically performs calibrations of the memory subsystem. Calibration may be performed for a delay applied to a data strobe used to synchronized transfers of data between the memory controller and the memory, and a reference voltage used to distinguish between a logic 0 and a logic 1 during memory reads. Following the performance of a calibration, the values of the delay and the reference voltage may be set based on an average of a most recent number of calibrations.

Apparatus and method for memory calibration averaging

In some embodiments, the semiconductor package includes a substrate having multiple layers, from a first layer to a final layer, a die coupled to the first layer, an electrical connector such as a solder ball coupled to the final layer, and a spiral trace disposed and electrically coupled between the die and the electrical connector. Inductance of the spiral trace is selected such that the package has a predetermined impedance. Material, cross-sectional area, number and density of windings, and total overall length of the spiral trace are selected accordingly. In other embodiments, the semiconductor package includes a substrate with multiple layers; a die coupled to the first of the layers; an electrical connector coupled to the final layer; and a spiral trace, in or on the substrate. The spiral trace is near the die, and electrically coupled between the die and the electrical connector.

Semiconductor package with embedded spiral inductor

The semiconductor module is provided that includes a semiconductor housing and a plurality of integrated circuit dice positioned within the housing. The semiconductor module also includes a programmable memory device positioned within the housing and electrically coupled to the plurality of integrated circuit dice. The programmable memory device is programmable to identify the integrated circuit dice that meet a predetermined standard, such as an operating frequency requirement, or a core timing grade. Further, a method is provided for accessing a semiconductor module. The above mentioned housing is provided to enclose the plurality of integrated circuit dice and the programmable memory device. The integrated circuit dice of the plurality of integrated circuit dice that meet a predetermined standard are then identified. The programmable memory device is subsequently programmed to identify the selected integrated circuit dice.

Stacked semiconductor module

The multilayer substrate includes a plurality of layers. Located within the plurality of layers are a number of vias. Conductive traces connect the vias to form trace/via paths having various topologies, geometries, and/or properties.

Multilayer flip-chip substrate interconnect layout

Systems and methods for reducing electrical noise generated during bus turnaround in signal transfer systems are provided. These systems include differential drivers having current sources continuously coupled to a signal bus during all operating modes of the drivers. A first transistor of the driver couples a first signal line of the bus to the driver current source and a second transistor of the driver couples a second signal line of the bus to the driver current source. Each transistor receives control signals in accordance with the operating mode of the driver. These control signals continuously and selectively couple the current source to the bus lines in a manner which provides uniform current distribution across the bus during all driver operating modes. The uniform current distribution across the bus minimizes interruptions in driver current dissipation and any effects from self-induced supply noise during signal transfers.

Reducing electrical noise during bus turnaround in signal transfer systems

Growing community of inventors

Palo Alto, CA, United States of America

Xingchao C Yuan