The Hong Kong University of Science and Technology

Xinfeng Zhang

Matthew Ming Fai Yuen

Kai Zhang

Kan Kan Yeung

Matthew Ming-Fai Yuen

Zhaoli Gao

Wayman Ngai Man Wong

Min Zhang

Huansu Xu

An electrical and thermal conductive paste composition includes a wetting agent that is arranged as a conduction promoter. Further, a method produces an electrical and thermal conductive paste composition by using a wetting agent as a conduction promoter or a conductivity promoter. The electrical and thermal conductivity of a conductive particle-filled polymer composite is enhanced by using the wetting agent. Capillary forces exerted by the wetting agent cause a particle-filled polymeric suspension to percolate at a decreased volume fraction into a highly conductive network and enhance the conductivity of the composite. Through a jamming gelation technique, the percolation threshold in the particle filled polymer composite is lowered to as low as 3 volume percent. As a result, the electrical and thermal conductivity of the composite is maintained at a significantly lower filler volume fraction with a reduction of particle filler content of up to 50 weight percent.

Electrical and thermal conductive paste composition and method of reducing percolation threshold and enhancing percolating conductivity using the same

A thermal interface material provides thermal conduction or thermal dissipation across an interface, using a three-dimensional interconnected porous graphene (3D-IPG) foam structure. The 3D-IPG foam structure is constructed of three-dimensional interconnected graphene sheets formed as a plurality of monolayers, and having an flexible interconnection architecture. The flexible interconnection architectures allow the 3D-IPG to maintain a high interfacial thermal conductance by the 3D-IPG filling a gap between a heat source and a heat sink across the interface, and by capping small features up to nanoscale roughened surfaces.

Three dimensional interconnected porous graphene-based thermal interface materials

A conductive thin film device includes a substrate and a thin film structure applied to the substrate. The thin film structure is applied as a first layer and forms a one-dimensional nanomaterial networked layer deposited on the substrate. A coating layer overlays the one-dimensional nanomaterial networked layer and can be made from graphene or graphene oxide. The coating layer at least partially covers the nanomaterial networked layer, thereby forming the device as a double-layer structure.

Electrical and thermal conductive thin film with double layer structure provided as a one-dimensional nanomaterial network with graphene/graphene oxide coating

Growing community of inventors

Hong Kong, China

Xinfeng Zhang