Delta Electronics (shanghai) Co., Ltd

Xin Zou

Shouyu Hong

Jinping Zhou

Qingdong Chen

Ganyu Zhou

Mingzhun Zhang

Jiaoping Huang

Tao Wang

Weiqiang Zhang

Pengkai Ji

Zhenqing Zhao

Liping Sun

Wei Cheng

Haibin Xu

Chao Ji

Lanyan Xu

A power module includes a substrate, at least one power unit, a first carrier plate and at least one input capacitor. The power unit is disposed on the substrate and includes at least one half-bridge circuit including a first power switch and a second power switch connected in series. A second terminal of the first power switch and a first terminal of the second power switch are connected to a node. The first carrier plate and the input capacitor are arranged between the power unit and the substrate. A first electrode of the substrate is connected with the node through the first carrier plate. A top surface of a first terminal of the input capacitor is connected with a first terminal of the first power switch, and a top surface of a second terminal of the input capacitor is connected with a second terminal of the second power switch.

Power module

The present disclosure provides a data processing device. The data processing device includes a carrier board, a data processor, a power module, a first heat sink, and a heat transfer plate. The data processor is provided above the carrier board. The power module is provided below the carrier board and supplies power to the data processor through the carrier board. The first heat sink is provided above the carrier board. The heat transfer plate includes a main body portion and a first extension. The main body portion is provided below the power module. The first extension portion extends upward from the main body portion and is connected to the first heat sink.

Data processing device

A power module and a carrier board are disclosed. The carrier board includes a circuit board body and a prefabricated substrate. The circuit board body includes a wiring layer. The prefabricated substrate is embedded in the circuit board body and includes an insulation layer and a metal layer, the metal layer is disposed on the insulation layer. The insulation layer is formed by a ceramic material. The metal layer is connected to the insulation layer through a sintering process. A surface of the insulation layer, which has contact with the at least one metal layer, has at least a part exposed outside of the at least one metal layer, the part of the insulation layer exposed to the outside of the at least one metal layer is an outer edge portion, and the outer edge portion is extended into the circuit board body along a horizontal direction.

Carrier board and power module using same

A substrate includes a first insulation layer, a passive component, a first through-hole structure, a second insulation layer and a second electrode. The first insulation layer has a top surface and a bottom surface. The passive component is embedded in the first insulation layer. The passive component includes a first conducting terminal. The first through-hole structure is formed in the first insulation layer. The first through-hole structure includes a conductive part and an insulation part disposed within the conductive part. The conductive part is in contact with the first conducting terminal and formed as a first electrode. The second insulation layer is disposed on portion of the conductive part that is close to the bottom surface of the first insulation layer. At least part of the second electrode is disposed on the second insulation layer. The second electrode is in contact with the first insulation layer.

Substrate, manufacturing method, and power module with same

A power module and a production method of the same, wherein a metal substrate is connected with the connection substrate in a high temperature, and in a process of cooling from a high temperature to a low temperature, an upper surface and a lower surface of the metal substrate are bendingly deformed toward the connection substrate, and the upper surface of the metal substrate is formed as a curved surface protruding toward the connection substrate, then the lower surface of the metal substrate is processed into a plane. In the power module and the production method of the disclosure, the second bonding material between the metal substrate and the connection substrate has a larger edge thickness, which reduces the thermal stress that the edge of the second bonding material is subject to, thereby improving the reliability of the power module while the power module has good heat dissipation performance.

Power module and production method of the same

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Shanghai, China

Xin Zou