Western Digital Technologies, Inc.

Ecolab USA Inc.

University of Kentucky Research Foundation

Sandisk Semiconductor (shanghai) Co. Ltd.

Xin Lu

Junrong Yan

Weili Wang

Chin-Tien Chiu

Li Ping Wang

Craig T Jordan

Peng Lu

Cong Zhang

Chee Keong Chin

Chunyang Li

Jinming Zhang

Xiaofeng Di

Jeffrey A Moscow

Qi Deng

CheeKeong Chin

Pradeep Rai

Chaur Yang Ng

Chenlin Yang

Jianbin Gu

Consumer and industrial 2-in-1 alkaline ware washing compositions providing both detergency and rinseability in a single cleaning composition are disclosed. Further benefits can be achieved with low levels of rinse aid surfactants in a rinse additive following the alkaline ware washing composition, including levels of rinse additive surfactant of about 500 ppm surfactant or less. Alkaline ware washing compositions and methods of using the same provide user-friendly, solid, ware washing compositions without the need for using a separate rinse aid composition.

Ware washing solution containing oxidized starch

A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.

Semiconductor device including vertical wire bonds

A process includes forming one or more apertures on a component backside, creating a vacuum in a mold chase, and engaging the component backside with a mold compound in the mold chase. The one or more apertures form an aperture structure. The aperture structure may include multiple apertures parallel or orthogonal to each other. The apertures have an aperture width, aperture depth, and aperture pitch. These characteristics may be altered to minimize the likelihood of trapped air remaining after creating the vacuum in the mold chase.

Aperture structure on semiconductor component backside to alleviate delamination in stacked packaging

A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A spacer layer is also mounted to the substrate, with the semiconductor die fitting within an aperture or a notch formed through first and second major opposed surfaces of the spacer layer. Additional semiconductor die, such as flash memory die, may be mounted atop the spacer layer.

Spacer layer for embedding semiconductor die

A novel organic cation transporter (OCT) gene, OCT 6, and use thereof is described. The OCT6 gene is preferentially expressed in human hematopoietic tissues, including CD34+ cells and leukemia cells. Its narrow tissue distribution, substrate specificity, and close homology to other cell membrane transporters make OCT6 an attractive target for the treatment of myeloid diseases.

Organic cation transporter preferentially expressed in hematopoietic cells and leukemias and uses thereof

Growing community of inventors

Shanghai, China

Xin Lu