Dell Products Inc.

Commscope Telecommunications (Shanghai) Co. Ltd.

Sandisk Semiconductor (Shanghai) Co. Ltd.

Xin Hua Tian

LiMing Wang

Nicholas D Abbatiello

Jianfeng Jin

Chuan Beng Sim

Zhengbin Wang

Wenyong Fan

Deeder M Aurongzeb

Peng Lip Goh

Chee Keong Chin

Junrong Yan

Weili Wang

Kim Lee Bock

Hin Loong Wong

Chong Un Tan

Xiu Feng Qiao

Hang Zhang

A composite carbon fiber laminate, including a first carbon fiber woven fabric layer, including one or more first voids defined between fabric strands of the first carbon fiber woven fabric layer; a second carbon fiber woven fabric layer, including one or more second voids defined between fabric strands of the second carbon fiber woven fabric layer; a core fabric layer; a first reflective layer positioned between the first carbon fiber woven fabric layer and the core fabric layer; and a second reflective fabric layer positioned between the second carbon fiber woven fabric layer and the core fabric layer, wherein the first reflective layer reflects light that is incident upon the first carbon fiber woven fabric layer at the one or more first voids.

Composite carbon fiber laminate for an information handling system

Disclosed is a keyboard for an information handling system. The keyboard includes a top cover comprising a polyester and a plurality of jute fibers, a keycap assembly comprising one or more keycaps, and a bottom cover comprising a first polylactic acid (PLA) and a post-consumer resin (PCR). The keycap assembly can be positioned between the top cover and the bottom cover, and the top cover can include one or more openings keycap assembly keycaps to protrude through.

Keyboard with recycled and biodegradable composite material for an information handling system

Inflatable toy

A fiber optic connection assembly for fiber to the home, comprising: a fan-out member; a multi-fiber optical cable having a first end introduced into the fan-out member and a second end extending out of the fan-out member; a multi-fiber optic connector connected to the second end of the multi-fiber optical cable; a plurality of single-fiber optical cables each having a first end introduced into the fan-out member and spliced with a respective one of fibers of the multi-fiber optical cable and a second end extending out of the fan-out member; and a plurality of single-fiber optic connectors connected to the second ends of the single-fiber optical cables, respectively; a plurality of first fiber optic adapters mated with the plurality of single-fiber optic connectors, respectively; and a plurality of outer shields each constructed to receive the connector and the adapter of a respective single-fiber optical cable therein, wherein the outer shield is hermetically fitted on the connector and the adapter of the respective single-fiber optical cable to form a sealed inner chamber so as to prevent moisture or water from entering into the inner chamber.

Fiber optic connection assembly

In accordance with embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and compression molding an in-mold decoration film to a side of the sheet of structural material. In accordance with these and other embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and adhesively bonding a chassis attachment frame to the sheet of structural material, the chassis attachment frame having one or more attachment features for mechanically coupling the structural member to other one or more other components. In accordance with these and other embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and molding a chassis attachment frame comprising sheet molding compound to the structural material.

Systems and methods for manufacturing structural materials

A semiconductor die is disclosed including corner recesses to prevent cracking of the semiconductor die during fabrication. Prior to dicing the semiconductor die from the wafer, recesses may be formed in the wafer at corners between any pair of semiconductor die. The recesses may be formed by a laser or photolithographic processes in the kerf area between semiconductor die. Once formed, the corner recesses prevent cracking and damage to semiconductor die which could otherwise occur at the corners of adjacent semiconductor die as the adjacent semiconductor die move relative to each other during the backgrind process.

Semiconductor device including corner recess

Growing community of inventors

Shanghai, China

Xin Hua Tian