Huawei Technologies Co., Limited

Xidong Yao

Yeren Wang

Changyi Liu

Dongming Lu

Xiaoguang Sun

Xudong Fei

Bingbing Tong

The cabinet includes a body and a heat dissipation apparatus. A plurality of installation slots for servers to enter along a preset installation direction are disposed on the body. The heat dissipation apparatus is configured to perform heat dissipation on devices of the servers, the heat dissipation apparatus is disposed on at least one side of the body along the installation direction, and the heat dissipation apparatus is connected to the devices of the servers. In this way, heat dissipation is performed on each server in the body, and space reserved between two adjacent rows of cabinets can be effectively used to reduce occupation of space in a left-right direction or an up-down direction in the body, thereby reducing limitation on a size of the cabinet and a size of a device in the cabinet.

Heat dissipation method, heat dissipation apparatus, and cabinet

A photographing device includes a housing configured to carry an electronic component of the photographing device, such as a lens system and an expansion system. A lens cavity and an expansion cavity isolated from each other are disposed in the housing. The lens system is disposed in the lens cavity, a heat dissipation apparatus is disposed in the expansion cavity, and the expansion system is disposed on the heat dissipation apparatus and is thermally coupled to the heat dissipation apparatus. In addition, the disposed heat dissipation apparatus is further thermally coupled to the lens system. A heat dissipation channel isolated from the expansion cavity is disposed in the heat dissipation apparatus.

Photographing device and communication device

A communications device is disclosed, the device includes a container, at least one power module, at least one temperature regulating module, and multiple boards. The container is configured to accommodate the at least one temperature regulating module and the multiple boards, and the container is further configured to accommodate a power bus layer. The power bus layer is connected to the at least one power module, the at least one temperature regulating module, and the multiple boards. The at least one power module is configured to supply power to the at least one temperature regulating module and the multiple boards by using the power bus layer. At least part of communication among the multiple boards, the at least one power module, and the at least one temperature regulating module is performed in a power line communications manner by using the power bus layer.

Growing community of inventors

Shenzhen, China

Xidong Yao