Taiyo Ink Mfg. Co., Ltd.

Xiaozhu Wei

Hiroshi Matsumoto

Shoji Minegishi

Masayuki Shimura

Daichi Okamoto

Rina Yoshikawa

Hideyuki Ito

Kazuya Okada

Shuichi Yamamoto

[Problem to be Solved] Provided is a curable composition for inkjet printing, a coating film obtained from which has higher heat resistance than conventional coating films. [Solution] It is a curable composition for inkjet printing, comprising (A) a (meth)acrylate monomer having a cyclic skeleton and having a number of alkylene oxide modifications of one or more and six or less, (B1) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having two or more alkylene glycol structures, (B2) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having a monoalkylene glycol structure, and (C) a photopolymerization initiator. Accordingly, an obtained coating film does not crack, has excellent adhesion to a conductor, and maintains sufficient hardness even after a thermal history that corresponds to a plurality of times of soldering. The above problem to be solved is also solved by a curable composition for inkjet printing, comprising (A') a (meth) acrylate monomer having a cyclic skeleton and having a number of alkylene oxide modifications of one or more and six or less, (B1&#x2032;) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having two or more alkylene glycol structures, (B2&#x2032;) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having a monoalkylene glycol structure, and (C&#x2032;) a photopolymerization initiator.

Curable composition for inkjet printing, cured product of same, and electronic component having the cured product

An alkaline development-type curable resin composition having an excellent strength against tearing, breaking, distortion and torsion, and excellent toughness, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are disclosed. A curable resin composition is obtained, which contains (A) a thermoplastic resin, (B) a thermosetting component, (C) an alkali-soluble component, and at least one of (D-1) a photopolymerization initiator and (D-2) a photo-base generator, the thermoplastic resin (A) having two or more glass transition points including two glass transition points Tgx and Tgy, which satisfy Tgx&#x3e;30&#xb0; C. and Tgy&#x3c;0&#xb0; C. and the thermosetting component (B) having a glass transition point Tgz, which satisfies Tgz&#x2267;Tgy+20&#xb0; C. Moreover, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are obtained.

Curable resin composition, cured product thereof, printed circuit board comprising the same, and method for producing the cured product

Growing community of inventors

Kawagoe, Japan

Xiaozhu Wei