Fujitsu Corporation

Taiyo Yuden Co., Ltd.

Fujitsu Media Devices Limited

Xiaoyu Mi

Satoshi Ueda

Takeo Takahashi

Hisao Okuda

Tsuyoshi Matsumoto

Yoshihiro Mizuno

Takeaki Shimanouchi

Hiromitsu Soneda

Osamu Toyoda

Masahiko Imai

Osamu Tsuboi

Tsuyoshi Yokoyama

Ippei Sawaki

Yu Yonezawa

Norinao Kouma

Naoyuki Mishima

Takashi Matsuda

Tokihiro Nishihara

Kazunori Inoue

Masafumi Iwaki

Shogo Inoue

Fumihiko Nakazawa

Nobuhisa Aoki

Yuuta Nakaya

Takeshi Takano

Hiroaki Inoue

Jyouji Kimura

Tsuyoshi Matsuomoto

A palpation assisting apparatus includes a synchronization controller configured to synchronize a timing of acquiring pressure data output from a pressure sensor attached to a position in contact with a lesion part with a timing of acquiring positional information of a marker attached to a position corresponding to the pressure sensor, and an entering part configured to store, in a storage part, the pressure data and the positional information of the marker that are acquired at the synchronized timing in association with time information indicating a time at which the pressure data and the positional information are acquired.

Palpation assisting apparatus, palpation assisting system, and palpation assisting method

A filter includes a substrate; a signal line formed on the substrate and including an input terminal and an output terminal at either end of the signal line; and a first pair of resonant lines connected between the signal line and a ground portion, wherein the first pair of resonant lines are connected to the signal line at the same point.

Filter

On seed metal layer of first metal, pedestal and counter electrode are formed of second metal by plating, adjacent to free space region. The free space region is filled with first sacrificial layer. By using resist pattern, second sacrificial metal layer is formed, extending from the first sacrificial layer to a portion of the pedestal, and lower structure of third metal is formed on the second sacrificial layer, by contiguous plating, exposing a portion of the pedestal not formed with the second sacrificial layer, the third metal having composition and thermal expansion coefficient equivalent to the second metal. Upper structure of fourth metal having composition and thermal expansion coefficient equivalent to the second and third metals is formed on the pedestal and the lower structure by plating. The first and second sacrificial layers are removed, leaving an electric equipment with a movable portion.

Electric equipment having movable portion, and its manufacture

A variable filter includes, on a dielectric substrate including ground conductor, first resonator including a transmission line connected to input terminal, second resonator including a transmission line connected to output terminal, and coupling portion including a transmission line having one end connected to the first and second resonators and another end being an open end, or structure having one end connected to the first and second resonators, including a serial connection of a transmission line and a variable capacitor, another end of the variable capacitor connected to the ground conductor, and adjusting means capable of changing electric length, in the first and second resonators and the coupling portion, wherein pass band width can be changed by changing ratio of electric transmission length of the coupling portion to electric transmission lengths of transmission line including the coupling portion, and the first and second resonators.

Variable filter and communication apparatus

An electronic component includes: a multilayer ceramic substrate that has a penetration electrode formed therein, and has a passive element provided on the upper face thereof; an insulating film that is provided on the multilayer ceramic substrate, and has an opening above the penetration electrode; a first connecting terminal that is provided on the insulating film so as to cover the opening, and is electrically connected to the penetration electrode; and a second connecting terminal that is provided on a region of the insulating film other than the opening region.

Electronic component

There is proved a variable capacitor that includes a substrate, a signal line disposed on a surface of the substrate for feeding a signal, a ground electrode disposed on the surface, and a movable electrode opposed the signal line and the ground electrode, the movable electrode operable to move toward and away from the signal line and the ground electrode. The movable electrode can be displaced by an electrostatic attraction between the movable electrode and the signal line and between the movable electrode and the signal line. An amount of displacement of the movable electrode varies according to an amount of the voltage which generates the electrostatic attraction.

Variable capacitor, matching circuit element, and mobile terminal apparatus

A variable distributed constant line includes a substrate, a signal line that is provided on the substrate, and includes a first line portion and a second line portion facing each other, a movable electrode that is provided above the substrate, and straddles both the first line portion and the second line portion in a manner to face the first line portion and the second line portion, and a driving electrode that is provided on the substrate in a manner to face the movable electrode, attracts the movable electrode by an action of a voltage applied between the driving electrode and the movable electrode, and changes a distance between the signal line and the movable electrode.

Variable distributed constant line, variable filter, and communication module

An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.

Integrated electronic device and method of making the same

A MEMS device includes a substrate, a fixed electrode that is provided on the substrate and allows a signal to pass therethrough, a movable electrode that is provided above the substrate in a manner to face the fixed electrode and allows a signal to pass therethrough, a driving line that is provided inside the substrate and used to apply a driving voltage to displace the movable electrode, and a resistance that is provided in a first via hole formed inside the substrate and used to cutoff a signal. The fixed electrode or the movable electrode is connected to the driving line through the first resistance.

MEMS device

An electronic part module includes a wiring substrate, a passive device group of passive devices formed on the wiring substrate, and device chips mounted on the wiring substrate. Such an electronic part module is made in the following manner. First, a wiring substrate wafer is made, to include a plurality of electronic part module formation areas. Then, a plurality of passive devices are formed in each of the electronic part module formation areas on the wiring substrate wafer. Then, the device chips are formed on each of the electronic part module formation areas on the wiring substrate wafer. Finally, the wiring substrate wafer is divided.

Electronic part module and method of making the same

An electronic device includes a substrate, a coil that has a spiral shape and is provided on the substrate, and a conductive pattern that is provided inside of the coil, has optical reflectivity higher than that of a surface of the coil, and is divided into pieces.

Electronic device

A method of manufacturing an electronic device includes forming a photosensitive SOG oxide layer on a multi-layer ceramics substrate having a penetrating electrode, forming an opening by subjecting the photosensitive SOG oxide layer to an exposure treatment and developing treatment so that an upper face of the penetrating electrode is exposed, and forming a passive element on the photosensitive SOG oxide layer, the passive element being connected to the penetrating electrode through the opening.

Method of manufacturing electronic device

A method of fabricating an electronic device includes selectively forming a glass layer on a ceramic substrate by printing, baking the glass layer, and forming a capacitor on the glass layer, the capacitor including metal electrodes and a dielectric layer interposed between the metal electrodes.

Method of fabricating the electronic device

A micro-device includes a movable part, a frame and a connecting part. The movable part has a main portion, a first capacitor electrode and a first driver electrode. The capacitor electrode and the driver electrode have electrode teeth extending from the main portion. The frame includes second capacitor and driver electrodes, where the second capacitor electrode has electrode teeth extending toward the first capacitor electrode, and the second driver electrode has electrode teeth extending toward the first driver electrode. The connecting part connects the movable part to the frame. The first and second capacitor electrodes have their electrode teeth overlapped in their initial position. The movable part is rotatable for varying the extent of the overlapping between the first and second driver electrodes.

Movable micro-device

A variable capacitor is provided which is appropriate for suppressing fluctuation in driving voltage characteristic and for achieving a larger variation ratio of static capacitance. The variable capacitor includes a fixed electrode and a movable electrode. The fixed electrode includes a first opposing face, while the movable electrode includes a second opposing face that faces the first opposing face. The movable electrode further includes a curved portion that protrudes toward the fixed electrode. The variable capacitor also includes a dielectric pattern provided on the first opposing face.

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Kawasaki, Japan

Xiaoyu Mi