Acm Research (shanghai) Inc.

Acm Research, Inc.

Shanghai Innovative Chang'an Biological Technology Co., Ltd.

Honeywell International Inc.

Shanghai Public Health Clinical Center

Shanghai Outdo Biotech Co., Ltd.

Xiaoyan Zhang

Fuping Chen

Xi Wang

Hui Wang

Fufa Chen

Jun Wang

Jian Wang

Xuejun Li

Zhaowei Jia

Yinuo Jin

Liangzhi Xie

Shena Jia

Wenjun Wang

Jianqing Xu

Hongchao Yang

Shu Qing Yang

Voha Nuch

Xin Wang

Xiaofeng Tao

Jingjing Liu

Jing Wang

He Wang

Yu Du

Ting Yao

Deyun Wang

Hengjun Gao

Zishao Zhong

Lingyan Zhu

Chenli Qiu

Guangyu Xia

Xinci Xie

Methods and an apparatus for removing particles or photoresist on substrates. In an embodiment, a method comprises the following steps: transferring one or more substrates into a DIOsolution accommodated in a DIObath; after the one or more substrates are processed in the DIObath, taking the one or more substrates out from the DIObath and transferring the one or more substrates into a SPM solution accommodated in a SPM bath; after the one or more substrates are processed in the SPM bath, taking the one or more substrates out from the SPM bath and rinsing the one or more substrates; and transferring the one or more substrates to one or more single chambers to perform single substrate cleaning and drying process. The method combines DIOand SPM in one cleaning sequence, which can remove particles or photoresist, especially remove photoresist treated by medium dose or high dose of ion implantation.

Method and apparatus for removing particles or photoresist on substrates

An HP spherical deformation diagnosis model and a construction method thereof are provided. The HP spherical deformation diagnosis model is used for identifying whether HP spherical deformation exists in an IHC dyeing image of an HP positive gastric mucosal sample, and includes: an image processing module and an identification module; the image processing module comprises a contrast enhancement module, an image filtering module, and an HP dyeing extraction module; the contrast enhancement module comprises: an HIS color model transformation module, which is used for transforming an original image from an RGB color model to an HIS color model in which hue, saturation, and intensity are separated; and a piecewise linear transformation module, which is used for enhancing a grayscale region of interest in the image by using a piecewise linear transformation method for a brightness component in the HIS color module, so as to improve the image.

HP spherical deformation diagnosis model and construction method thereof

The present disclosure relates to a novel influenza immunogen with broad-spectrum anti-influenza virus effect and the immunization method thereof. The present disclosure provides a novel anti-influenza immunogen whose sequence comprises the amino acid sequence shown in SEQ ID No: 1 and SEQ ID No: 2, or an immunogenic fragment thereof, or a combination thereof. In addition, the present disclosure also provides use of the recombinant vector vaccine using said immunogen in the anti-influenza vaccine, and the immunization method of the recombinant vector vaccine using said immunogen. Through the sequential administration of multiple vector vaccines expressing the novel influenza immunogen, and the combined use of systemic administration and local administration, a high-level T cell immune response is induced in the local respiratory tract, which can produce broad-spectrum protection against multiple influenza virus infections.

Immunogen for broad-spectrum influenza vaccine and application thereof

A coater with automatic cleaning function and a coater automatic cleaning method. The coater () includes a coater chamber () capable of being filled up with cleaning solution, a substrate chuck () holding and positioning a substrate (), and at least one shroud () capable of moving up for preventing photoresist from splashing out of the coater chamber (), or moving down and immersing into the cleaning solution for cleaning. The coater () automatic cleaning method includes the following steps: turning off a liquid outlet valve (A,B,) of the coater (); filling up a coater chamber () with cleaning solution; after photoresist in the coater chamber () being dissolved into the cleaning solution, turning on the liquid outlet valve (A,B,) and draining the cleaning solution out of the coater chamber ().

Coater with automatic cleaning function and coater automatic cleaning method

A method for cleaning a substrate with pattern structures comprises the following steps: using gas-liquid atomization to clean a substrate surface (); using TEBO megasonic to clean the substrate surface (); and drying the substrate (). The TEBO megasonic cleaning is used to remove small size particles on the substrate and the gas-liquid atomization cleaning is used to remove large size particles on the substrate. The method enables achieving an effect of cleaning the substrate without or with less device damage. A substrate cleaning apparatus is also provided.

Substrate cleaning method and apparatus

Related to is a method for cleaning an in-process wafer. The method includes causing the in-process wafer to be rotated, causing function water to be applied to a surface of the rotated in-process wafer to generate a flowing function water film on the rotated in-process wafer, causing the surface of the in-process wafer to be cleaned by a sonic device for a first period, causing the sonic device to be lifted and/or rotation speed of the rotated in-process wafer to be accelerated to separate the sonic device from the flowing function water film, causing the function water to be applied to the surface of the rotated in-process wafer for a second period after separating the sonic device from the function water film, and causing the surface of the in-process wafer to be dried.

Methods and apparatus for cleaning semiconductor wafers

A method for cleaning semiconductor substrate without damaging patterned structure on the semiconductor substrate using ultra/mega sonic device comprises applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency fand power Pto drive the ultra/mega sonic device; before bubble cavitation in the liquid damaging patterned structure on the substrate, setting the ultra/mega sonic power supply at zero output; after temperature inside bubble cooling down to a set temperature, setting the ultra/mega sonic power supply at frequency fand power Pagain; detecting power on time at power P1 and frequency f1 and power off time separately or detecting amplitude of each waveform output by the ultra/mega sonic power supply; comparing the detected power on time with a preset time τ, or comparing the detected power off time with a preset time τ, or comparing detected amplitude of each waveform with a preset value, if the detected power on time is longer than the preset time τ, or the detected power off time is shorter than the preset time τ, or the detected amplitude of any waveform is larger than the preset value, shut down the ultra/mega sonic power supply and send out an alarm signal.

The present invention provides a method for cleaning substrates comprising the steps of: placing a substrate on a substrate holder; implementing a bubble less or bubble-free pre-wetting process for the substrate; and implementing an ultra/mega sonic cleaning process for cleaning the substrate.

Method and apparatus for cleaning substrates

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

System for cleaning semiconductor wafers

An apparatus for cleaning flip chip assemblies is provided. The apparatus comprises: a chuck assembly; a motor coupled to the chuck assembly by a spindle; at least one carrier for holding flip chips; at least one spray nozzle for directing DIW, a cleaning solution, a gas or a vapor. Embodiments of the invention further provide methods for cleaning flip chip assemblies. The method comprises: loading at least one flip chip to the flip chip carriers; rotating the chuck assembly at a rotation speed; flowing DIW for rinsing the flip chips; flowing a cleaning solution for removing the contaminants; applying ultrasonic/megasonic energy to the flip chips; blowing a gas or a vapor via the spray nozzles for drying the flip chips; bringing the flip chips out of the flip chip carriers.

Methods and apparatus for cleaning flip chip assemblies

The present invention discloses a method for cleaning substrate without damaging patterned structure on the substrate using ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency fand power Pto drive said ultra/mega sonic device; after micro jet generated by bubble implosion and before said micro jet generated by bubble implosion damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency fand power Pto drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency fand power Pagain; repeating above steps till the substrate being cleaned.

Methods and apparatus for cleaning substrates

Disclosed is a method for rapidly amplifying CD8+T cells and functional cell subpopulations thereof in vitro. A TLR1/2 agonist, a TLR2/6 agonist and a TLR5 agonist or a combination of above agonists is added to a conventional culture system for in-vitro amplification of CD8+T cells. Recombinant cytokines IL-2, IL-7 and IL-15 as well as magnetic beads coated with an anti-human CD3 antibody and an anti-human CD28 antibody can be further added to the culture system for continuous co-stimulation.

Method for amplifying CD8+T cells and cell subpopulations thereof in-vitro

A method for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: delivering a cleaning liquid over a surface of a semiconductor wafer during a cleaning process; and imparting sonic energy to the cleaning liquid from a sonic transducer during the cleaning process, wherein power is alternately supplied to the sonic transducer at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, the first predetermined period of time and the second predetermined period of time consecutively following one another, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

Method for cleaning semiconductor wafers

A method for effectively cleaning vias (), trenches () or recessed areas on a substrate () using an ultra/mega sonic device (), comprising: applying liquid () into a space between a substrate () and an ultra/mega sonic device (); setting an ultra/mega sonic power supply at frequency fand power Pto drive said ultra/mega sonic device (); after the ratio of total bubbles volume to volume inside vias (), trenches () or recessed areas on the substrate () increasing to a first set value, setting said ultra/mega sonic power supply at frequency fand power Pto drive said ultra/mega sonic device (); after the ratio of total bubbles volume to volume inside the vias (), trenches () or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency fand power Pagain; repeating above steps till the substrate () being cleaned.

Growing community of inventors

Shanghai, China

Xiaoyan Zhang