International Business Machines Corporation

International Business Corporation

Xiaoyan Shao

Hariklia Deligianni

Harold John Hovel

Cyril Cabral, Jr

Steven Erik Steen

John Michael Cotte

Stephen Mark Rossnagel

Christian Lavoie

Sandra Guy Malhotra

Laura Louise Kosbar

Philippe M Vereecken

Anna Wanda Topol

Qiang Huang

Rainer Klaus Krause

Randolph F Knarr

Kathryn C Fisher

Veeraraghavan S Basker

Josephine B Chang

Hendrik F Hamann

Bin Yang

Katherine Lynn Saenger

Paul Michael Solomon

Alejandro Gabriel Schrott

Bucknell Chapman Webb

Zhen Zhang

Martin Michael Frank

Wilfried Haensch

Matthew Joseph Breitwisch

Eric Andrew Joseph

Vamsi Krishna Paruchuri

Deborah A Neumayer

Dario Leonardo Goldfarb

George Frederick Walker

Gustavo Alejandro Stolovitzky

Rajarao Jammy

Emanuel Israel Cooper

Stefan Harrer

Stanislav Polonsky

Siyuan Lu

Hongbo Peng

Shafaat Ahmed

Ronald Dean Goldblatt

James Vichiconti

Matteo Flotta

Christine Qiqing Ouyang

Zhu Liu

Devendra K Sadana

Ali Afzali-Ardakani

Oscar Van Der Straten

Kenneth Parker Rodbell

Laertis Economikos

Lubomyr Taras Romankiw

Balasubramanian S Haran

Jeffrey Curtis Hedrick

Nicholas C M Fuller

Glenn John Martyna

Markus Schmidt

Binquan Luan

Hans-Juergen Eickelmann

Christopher Carr Parks

Satyavolu S Papa Rao

Andrew John Kellock

Michael Haag

Venkatram Venkatasamy

Eva Erika Simonyi

Philippe Mark Vereecken

Tsong-Lin Tai

Catherine Ivers

Ali Afzali-Azdakani

Lubomyr T Romanikiw

Lili Deligianni

A solar cell panel with a bottom cover plate and an electrically conductive bus bar. A top cover plate having at least one electrically conductive land in communication with a bottom surface of the top cover plate. The land having a height extending from the bottom surface of the top cover plate. An array of rows and columns of solar cell chips lying between the bottom cover plate and the top cover plate. Each solar cell chip of the array having an anode adjacent to a top surface and a cathode adjacent to a bottom surface. The bus bar in electrical communication with each cathode of each solar cell chip of the array. Each land in electrical contact with each anode of a solar cell chip of the array. An opening formed between adjacent lands wherein the opening extends at least the height of the lands.

Solar cell panels and method of fabricating same

High-efficiency, ultra-low power gas sensors are provided. In one aspect, a gas detector device is provided which includes: at least one gas sensor having a plurality of fins; a conformal resistive heating element on the fins; a conformal barrier layer on the resistive heating element; and a conformal sensing layer on the barrier layer. A method of forming a gas sensor as well as a method for use thereof in gas detection are also provided.

3D micro and nanoheater design for ultra-low power gas sensors

The instant disclosure relates to contact grids for use in photovoltaic cells, wherein a cross-section of the contact grid fingers is shaped as a trapezoid, as well as a method of making photovoltaic cells comprising these contact grids. The contact grids of the instant disclosure are cost effective and, due to their thick metal grids, exhibit minimum resistance. Despite having thick metal grids, the unique shape of the contact grid fingers of the instant disclosure allow the photovoltaic cells in which they are employed to retain more solar energy than traditional solar cells by reflecting incoming solar energy back onto the surface of the solar cell instead of reflecting this energy away from the cell.

Low resistance, low reflection, and low cost contact grids for photovoltaic cells

A solar cell panel and method of forming a solar cell panel. The method includes a: forming an electrically conductive bus bar on a top surface of a bottom cover plate; forming an electrically conductive contact frame proximate to a bottom surface of a top cover plate, the top cover plate transparent to visible light; and placing an array of rows and columns of solar cell chips between the bottom cover plate and the top cover plate, each solar cell chip of the array of solar cell chips comprising an anode adjacent to a top surface and a cathode adjacent to a bottom surface of the solar cell chip, the bus bar electrically contacting each cathode of each solar cell chip of the array of solar cell chips and the contact frame contacting each anode of each solar cell chip of the array of solar cell chips.

A multigate structure which comprises a semiconductor substrate; an ultra-thin silicon or carbon bodies of less than 20 nanometers thick located on the substrate; an electrolessly deposited metallic layer selectively located on the side surfaces and top surfaces of the ultra-thin silicon or carbon bodies and selectively located on top of the multigate structures to make electrical contact with the ultra-thin silicon or carbon bodies and to minimize parasitic resistance, and wherein the ultra-thin silicon or carbon bodies and metallic layer located thereon form source and drain regions is provided along with a process to fabricate the structure.

Multigate structure formed with electroless metal deposition

A contact rhodium structure is fabricated by a process that comprises obtaining a substrate having a dielectric layer thereon, wherein the dielectric layer has cavities therein into which the contact rhodium is to be deposited; depositing a seed layer in the cavities and on the dielectric layer; and depositing the rhodium by electroplating from a bath comprising a rhodium salt; an acid and a stress reducer; and then optionally annealing the structure.

Fabricating a contact rhodium structure by electroplating and electroplating composition

Segmented semiconductor nanowires are manufactured by removal of material from a layered structure of two or more semiconductor materials in the absence of a template. The removal takes place at some locations on the surface of the layered structure and continues preferentially along the direction of a crystallographic axis, such that nanowires with a segmented structure remain at locations where little or no removal occurs. The interface between different segments can be perpendicular to or at angle with the longitudinal direction of the nanowire.

Super lattice/quantum well nanowires

The present disclosure provides a method of forming a back side surface field of a solar cell without utilizing screen printing. The method includes first forming a p-type dopant layer directly on the back side surface of the semiconductor substrate that includes a p/n junction utilizing an electrodeposition method. The p/n junction is defined as the interface that is formed between an n-type semiconductor portion of the substrate and an underlying p-type semiconductor portion of the substrate. The plated structure is then annealed to from a P++ back side surface field layer directly on the back side surface of the semiconductor substrate. Optionally, a metallic film can be electrodeposited on an exposed surface of the P++ back side surface layer.

Solar cells with plated back side surface field and back side electrical contact and method of fabricating same

A method of forming patterned metallization by electrodeposition under illumination without external voltage supply on a photovoltaic structure or on n-type region of a transistor/junction.

Electrodeposition under illumination without electrical contacts

A method to determine the cleanness of a semiconductor substrate and the quantity/density of pin holes that may exist within a patterned antireflective coating (ARC) is provided. Electroplating is employed to monitor the changes in the porosity of the ARC caused by the pin holes during solar cell manufacturing. In particular, electroplating a metal or metal alloy to form a metallic grid on an exposed front side surface of a substrate also fills the pin holes. The quantity/density of metallic filled pin holes (and hence the number of pin holes) in the patterned ARC can then be determined.

Method to evaluate effectiveness of substrate cleanness and quantity of pin holes in an antireflective coating of a solar cell

The present invention provides a method of forming an electrode having reduced corrosion and water decomposition on a surface thereof. A conductive layer is deposited on a substrate. The conductive layer is partially oxidized by an oxygen plasma process to convert a portion thereof to an oxide layer thereby forming the electrode. The oxide layer is free of surface defects and the thickness of the oxide layer is from about 0.09 nm to about 10 nm and ranges therebetween, controllable with 0.2 nm precision.

Forming an electrode having reduced corrosion and water decomposition on surface using a custom oxide layer

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Yorktown Heights, NY, United States of America

Xiaoyan Shao