Intel Corporation

Xiaoxuan Sun

Omkar G Karhade

Srinivas V Pietambaram

Nitin A Deshpande

Brandon C Marin

Sairam Agraharam

Yonggang Li

Jeremy D Ecton

Gang Duan

Suddhasattwa Nad

Xavier Francois Brun

Jason M Gamba

Haobo Chen

Bohan Shan

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface, in a first layer; a redistribution layer (RDL) on the first layer, wherein the RDL includes conductive vias having a greater width towards a first surface of the RDL and a smaller width towards an opposing second surface of the RDL; wherein the first surface of the RDL is electrically coupled to the second surface of the first die by first solder interconnects having a first solder; and a second die in a second layer on the RDL, wherein the second die is electrically coupled to the RDL by second solder interconnects having a second solder, wherein the second solder is different than the first solder.

Microelectronic assemblies including interconnects with different solder materials

Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

Microelectronic structures including bridges

Growing community of inventors

Phoenix, AZ, United States of America

Xiaoxuan Sun