Applied Materials, Inc.

Xiaoxiong Yuan

Dien-Yeh Wu

Salvador P Umotoy

Gwo-Chuan Tzu

Olkan Cuvalci

Mei Yin Chang

Avgerinos V Gelatos

Yu Wen Chang

Hyman W H Lam

Pingyan Lei

Bo Zheng

Sang Ho Yu

Kai Wu

Jallepally Ravi

Kazuya Daito

Anzhong Chang

Anh Ngoc Nguyen

Kenric T Choi

Manjunatha P Koppa

Michael Sterling Jackson

Daping Yao

Hua Ai

Anantha K Subramani

Paul F Ma

Ming Xi

Vincent W Ku

Yu Lei

Lawrence Chung-Lai Lei

Yi Xu

Umesh M Kelkar

Ashish Goel

Takashi Kuratomi

Vikash Banthia

Amit Khandelwal

See-Eng Phan

Michael P Karazim

Faruk Gungor

Anqing Cui

Yuanhong Guo

Hanh D Nguyen

Jiang Lu

Chiukin Steven Lai

Hougong Wang

Steve Sansoni

Sheng Michael Guo

Marek W Radko

Yuji Murayama

Pingping Gou

Vinod Konda Purathe

Jing Lin

Ron L Rose

Song-Moon Suh

Joseph Michael Ranish

Srinivas Gandikota

Michael Xiaoxuan Yang

Wei W Wang

Vijay D Parkhe

Hua Chung

Joseph Yudovsky

Muhammad M Rasheed

Schubert S Chu

Majeed Foad

Shamouil Shamouilian

Xinliang Lu

Yixiong Yang

Dieter Haas

Chien-Teh Kao

Joseph F AuBuchon

Cheng-Hsiung Matt Tsai

Joung Joo Lee

Wei V Tang

Zubin Huang

Joel M Huston

David T Or

Sang-Hyeob Lee

Siqing Lu

Henry Ho

Nicholas Ryan Denny

Karl J Armstrong

Bharath Swaminathan

Son Trinh

Aravind Kamath

William Kuang

Chih-Hsun Hsu

Sandesh Yadamane

Steven H Kim

Puneet Bajaj

Tomoharu Matsushita

Sal Umotoy

Can Xu

Hyman Lam

Benjamin C Wang

Devi Raghavee Veerappan

Hou Gong Wang

Emily Renuart

Wing-Cheong Lai

Bin V Cao

Jing-Pei Chou

Hongbee Teoh

Kyoung-Ho Bu

A method and apparatus for processing a substrate are described herein. The methods and apparatus described enable the raising and lowering of a shadow ring within a process chamber either simultaneously with or separately from a plurality of substrate lift pins. The shadow ring is raised and lowered using a shadow ring lift assembly and may be raised to a pre-determined height above the substrate during a radical treatment operation. The shadow ring lift assembly may also raise and lower the plurality of substrate lift pins to enable both the shadow ring and the substrate lift pins to be raised to a transfer position when the substrate is being transferred into or out of the process chamber.

Shadow ring lift to improve wafer edge performance

A method of cleaning a chamber for an electronics manufacturing system includes flowing a gas mixture comprising oxygen and a carrier gas into a remote plasma generator. The method further includes generating a plasma from the gas mixture by the remote plasma generator and performing a remote plasma cleaning of the chamber by flowing the plasma into an interior of the chamber, wherein the plasma removes a plurality of organic contaminants from the chamber.

Remote plasma cleaning of chambers for electronics manufacturing systems

Gas diffuser

Embodiments of a lid heater for a deposition chamber are provided herein. In some embodiments, a lid heater for a deposition chamber includes a ceramic heater body having a first side opposite a second side, wherein the ceramic heater body includes a first plurality of gas channels extending from one or more first gas inlets on the first side, wherein each of the one or more first gas inlets extend to a plurality of first gas outlets on the second side; a heating element embedded in the ceramic heater body; and an RF electrode embedded in the ceramic heater body proximate the second side, wherein the first plurality of gas channels extend through the RF electrode.

Gas distribution ceramic heater for deposition chamber

Ampoules for a semiconductor manufacturing precursors and methods of use are described. The ampoules include a container with an inlet port and an outlet port. The inlet port has a showerhead that the end within the container. The showerhead has at least two angled nozzles to direct the flow of gas within the cavity so that the gas flow is not perpendicular to the surface of a liquid within the ampoule.

Apparatus for increasing flux from an ampoule

Apparatus for processing a substrate are provided herein. In some embodiments a showerhead assembly includes a gas distribution plate having a plurality of apertures; a holder having a wall, an radially inwardly extending flange extending from a lower portion of the wall and coupled to the gas distribution plate, and a radially outwardly extending flange extending from an upper portion of the wall, wherein the wall has a thickness between about 0.015 inches and about 0.2 inches; and a heating apparatus disposed above and spaced apart from the gas distribution plate, wherein the heating apparatus includes a heater configured to heat the gas distribution plate.

Substrate processing chamber having heated showerhead assembly

Embodiments of showerheads are provided herein. In some embodiments, a showerhead for use in a process chamber includes a gas distribution plate having an upper surface and a lower surface; a plurality of channels extending through the gas distribution plate substantially perpendicular to the lower surface; a plurality of first gas delivery holes extending from the upper surface to the lower surface between adjacent channels of the plurality of channels to deliver a first process gas through the gas distribution plate; and a plurality of second gas delivery holes extending from the plurality of channels to the lower surface to deliver a second process gas therethrough without mixing with the first process gas.

High temperature dual chamber showerhead

Embodiments of a blocker plate for use in a substrate process chamber are disclosed herein. In some embodiments, a blocker plate for use in a substrate processing chamber configured to process substrates having a given diameter includes: an annular rim; a central plate disposed within the annular rim; and a plurality of spokes coupling the central plate to the annular rim.

Blocker plate for use in a substrate process chamber

Embodiments of lift pin assemblies and substrate supports having such lift pin assemblies are provided herein. In some embodiments, a lift pin assembly includes a body with a first end including a flange and an opposing second end; a bore through the body from the first end to the second end; a profile on an outer surface proximate a second end; and a collar, wherein the profile is configured to removably lock the collar onto the second end.

Substrate support plate with improved lift pin sealing

Apparatus and methods for supplying a gas to a processing chamber are described. The apparatus comprises an inlet line and an outlet line, each with two valves, in fluid communication an ampoule. A bypass line connects the inlet valve and outlet valve closest to the ampoule. The apparatus and methods of use allow a precursor residue to be removed from the delivery lines of a processing chamber.

Apparatus and methods to remove residual precursor inside gas lines post-deposition

Methods and apparatus for cleaning an atomic layer deposition chamber are provided herein. In some embodiments, a chamber lid assembly includes: a housing enclosing a central channel that extends along a central axis and has an upper portion and a lower portion; a lid plate coupled to the housing and having a contoured bottom surface that extends downwardly and outwardly from a central opening coupled to the lower portion of the central channel to a peripheral portion of the lid plate; a first heating element to heat the central channel; a second heating element to heat the bottom surface of the lid plate; a remote plasma source fluidly coupled to the central channel; and an isolation collar coupled between the remote plasma source and the housing, wherein the isolation collar has an inner channel extending through the isolation collar to fluidly couple the remote plasma source and the central channel.

Atomic layer deposition chamber with thermal lid

Embodiments of substrate supports and sealing rings for use in a substrate support are provided herein. In some embodiments, a substrate support structure includes an arcuate sealing piece having a first side including a generally planar support surface; a first arcuate portion; a second arcuate portion disposed radially inward of the first arcuate portion; a first end portion comprising a first arcuate extension extending from the first arcuate portion; and a second end portion comprising a second arcuate extension extending from the second arcuate portion.

Substrate support with multi-piece sealing surface

Growing community of inventors

San Jose, CA, United States of America

Xiaoxiong Yuan