Cisco Technology, Inc.

Xiaoxia Zhou

Alpesh Umakant Bhobe

Hailong Zhang

Jianquan Lou

Jinghan Yu

Yingchun Shu

Luli Gong

Xiao Li

Quanhui Sun

Hongmei Fan

Guangcao Fu

Huasheng Zhao

Philippe Sochoux

Phillipe Sochoux

Jing An

Luo Yonghong

Tie Ma

Harvey Yang

In one embodiment, an apparatus includes an array of transformers and common mode chokes each comprising a magnetic core and windings wound around the magnetic core at opposing locations on the magnetic core, and a retaining groove on each of the magnetic cores to maintain the windings in their opposing locations on the magnetic core. The transformers and common mode chokes are positioned in the array with the windings on each of the magnetic cores located offset to the windings of adjacent magnetic cores in the array to reduce crosstalk and improve common mode noise rejection.

Biorthogonal windings on transformer and common mode choke for network port

In one embodiment, an apparatus includes a plurality of optical module ports in communication with a physical layer device in a network device. Communication of signals from the physical layer device to the optical module ports is configured such that the signals received at the optical module ports adjacent to one another are at different phases to reduce electromagnetic interference associated with the optical module ports.

Multiple port network device with differential ports for reduced electromagnetic interference at optical modules

In one embodiment, an apparatus includes a plurality of transformers and a plurality of common mode chokes, each of the transformers and the common mode chokes comprising a magnetic core and windings wound around the magnetic core at generally opposite sides thereof. The transformers and common mode chokes are arranged in an array with the windings on each of the magnetic cores positioned generally orthogonal to the windings of adjacent magnetic cores in the array to reduce crosstalk and improve common mode noise rejection.

An apparatus is described for suppressing EMI emissions in an electrical device. In one example, the apparatus includes absorbing material surrounding at least a portion of an electrical component and electrically conductive material configured to contact at least one side of the absorbing material.

Shield to improve electromagnetic interference (EMI) suppression capability

An electromagnetic interference (EMI) shielding apparatus includes a cage structure having an opening at a first end and a second end opposite to first end. The cage structure is configured to contain one or more electrical components that emit electromagnetic energy and a connector for the one or more electrical components. The first end is configured to receive a pluggable module that is to connect to the one or more electrical components. The EMI shielding apparatus further includes a filler assembly disposed in the opening. The filler assembly is biased to close the opening of the cage structure when a pluggable module is not inserted/plugged in the opening.

Electromagnetic interference shielding apparatus

An electrical device includes a core structure having a first core section, a second core section, and a third core section. The electrical device further includes a first coil electrically coupled to the first core section and the second core section to form a choke and a primary winding of a transformer. The choke is configured to reduce common mode noise for an electrical signal received by the electrical device, and the primary winding of the transformer is configured to induce a magnetic field on the third core section. The electrical device also includes a second coil electrically coupled to the third core section, which forms a secondary winding of the transformer and receives electromagnetic energy from the magnetic field induced by the primary winding of the transformer.

Electrical device with integrated transformer and common mode choke

In one embodiment, an apparatus includes a faceplate for a computing device. The faceplate includes a first side and a second side. The faceplate also includes a chamfer formed between the first side and the second side. The chamfer runs along at least a portion of the first side and the second side. The chamfer includes at least one hole extending through only the chamfer.

Faceplate for a computing device

Techniques are provided for electrically connecting components on a printed circuit board (PCB), semiconductor chip package, or other electronic device. More specifically, a first component, configured to generate a differential signal, is disposed on the PCB, while a second component, configured to receive the differential signal from the first component, is also disposed on the PCB. A differential conductor pair comprising first and second parallel conductors extends along a path between the first and second components. The path of the differential conductor pair comprises at least one turn that causes a change in direction of the first and second conductors. The first conductor comprises at least one localized skew compensation bend disposed at the turn such that, at the end of the turn, the first and second conductors have substantially the same length with respect to the first component.

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Shanghai, China

Xiaoxia Zhou