Qualcomm Incorporated

Juniper Networks, Inc.

Xiaoxia Wu

Massimiliano Salsi

Seung Hyuk Kang

Chengjie Zuo

Xiaochun Zhu

Durodami Joscelyn Lisk

Yunqiang Yang

In some embodiments, an apparatus includes a processor configured to receive a set of digital samples associated with a set of optical signals received at a coherent optical receiver. The set of digital samples is associated with a set of optical channels. Each optical channel from the set of optical channels is spaced from at least one adjacent optical channel from the plurality of optical channels. The processor is configured to calculate, for each optical channel from the set of optical channels, a spacing between that optical channel and at least one adjacent optical channel from the set of optical channels based on digital signal processing of the set of digital samples. The processor is configured to send a signal indicating, for each optical channel from the set of optical channels, the spacing between that optical channel and the at least one adjacent optical channel.

Method for monitoring and correction of adjacent channel penalty in coherent optical transmission

A multi-core processor is presented. The multi-core processor includes a first spin transfer torque magnetoresistive random-access memory (STT-MRAM) cache associated with a first core of the multi-core processor and tuned according to first attributes and a second STT-MRAM cache associated with a second core of the multi-core processor and tuned according to second attributes.

Tunable multi-tiered STT-MRAM cache for multi-core processors

Some implementations provide an interposer that includes a substrate, a first passive device in the substrate, and a second passive device. The first passive device includes a first set of through substrate vias (TSVs) in the substrate. The second passive device is configured to wirelessly couple to the first passive device. In some implementations, the second passive device includes a second set of through substrate vias (TSVs) in the substrate. In some implementations, the second passive device is configured to inductively couple to the first passive device. In some implementations, the first passive device is a first inductor and the second passive device is a second inductor. In some implementations, the interposer further includes a first set of interconnects coupled to the first set of TSVs, and a second set of interconnects coupled to the second set of TSVs.

Wireless interconnects in an interposer

Growing community of inventors

San Jose, CA, United States of America

Xiaoxia Wu