Agency for Science, Technology and Research

Xiaowu Zhang

Gongyue Tang

Vaidyanathan Kripesh

Tai Chong Chai

Yong Han

Boon Long Lau

Xian Tong Chen

Kripesh Vaidyanathan

Cheryl Sharmani Selvanayagam

Navas Khan Oratti Kalandar

Alastair David Trigg

Chee Houe Khong

Cheng Kuo Cheng

Kazunori Yamamoto

Various embodiments may relate to a liquid cooling module. The liquid cooling module may include a main body. The main body may include a cooling core including a microfluidic structure configured to carry a cooling liquid. The main body may also include a plurality of slots. The liquid cooling module may further include a sealing pad configured to transmit heat from an electronic device to the cooling core. The liquid cooling module may additionally include a plurality of fins extending from the main body, each of the plurality of fins including an internal circulating liquid duct such that the liquid cooling module includes a plurality of internal circulating liquid ducts in fluidic communication with the microfluidic structure.

Liquid cooling module and method of forming the same

Various embodiments may provide a semiconductor package. The semiconductor package may include a first electrical component, a second electrical component, a first heat sink, and a second heat sink bonded to a first package interconnection component and a second package interconnection component. The first package interconnection component and the second package interconnection component may provide lateral and vertical interconnections in the package.

Plurality of heat sinks for a semiconductor package

A bonding stress testing arrangement and a method of determining stress are provided. The bonding stress testing arrangement includes at least one bond pad; a sensor assembly comprising any one of a first sensor arrangement, a second sensor arrangement and a combination of the first sensor arrangement and the second sensor arrangement; wherein the first sensor arrangement is adapted to measure an average stress on a portion of a bonding area under the at least one bond pad, and the second sensor arrangement is adapted to determine stress distribution over a portion or an entire of the bonding area under the at least one bond pad.

Bonding stress testing arrangement and method of determining stress

According to one embodiment of the present invention, a semiconductor structure is provided. The semiconductor structure includes a first support structure, a plurality of chips formed on the first support structure and a reinforcing structure formed on the first support structure, the reinforcing structure including an outer surrounding element which surrounds the plurality of chips and extends from a surface of the first support structure to a height higher than each of the plurality of chips. A method of manufacturing a semiconductor structure is also provided.

Semiconductor structure and a method of manufacturing a semiconductor structure

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Singapore, Singapore

Xiaowu Zhang