Applied Materials, Inc.

Apple Inc.

Xiaowei Wu

Jennifer Y Sun

Guodong Zhan

Michael Robert Rice

David Fenwick

Xiao Ming He

Dmitry Lubomirsky

Laksheswar Kalita

Paul Stephen Drzaic

Hoon Sik Kim

Soonam Park

Prerna Sonthalia Goradia

Toan Q Tran

Geetika Bajaj

Bhadrinarayana Lalgudi Visweswaran

Xiao-Ming He

Tae Won Kim

Terry C Lam

Chang-Chia Huang

Yasmin F Afsar

Ankur Kadam

Yuxi Zhao

Supriya Goyal

Cheng-Hsuan Chou

Atul Bhaskar Chaudhari

Certain embodiments of the present disclosure relate to methods of forming coated articles. In one embodiment, a method comprises depositing one or more rare earth metal-containing ceramic compounds on an article by atomic layer deposition, for example, to coat surfaces of high aspect ratio internal channels.

Atomic layer deposition coatings for high temperature ceramic components

Disclosed herein is a rare-earth oxide coating on a surface of an article with one or more interruption layers to control crystal growth and methods of its formation. The coating may be deposited by atomic layer deposition and/or by chemical vapor deposition. The rare-earth oxides in the coatings disclosed herein may have an atomic crystalline phase that is different from the atomic crystalline phase or the amorphous phase of the one or more interruption layers.

Zone-controlled rare-earth oxide ALD and CVD coatings

In devices with flexible displays, multilayer adhesive stacks may be included. A multilayer adhesive may attach a flexible display panel to the display cover layer in an electronic device. Including multiple layers of adhesive in the adhesive stack (as opposed to a single layer) provides more degrees of freedom for the tuning and optimization of the properties of the adhesive stack. The multilayer adhesive stack therefore has better performance than if only a single layer of adhesive is used. The multilayer adhesive stack may include one or more layers of soft adhesive, hard adhesive, hard elastomer, hard polymer, and/or glass to optimize the mechanical and optical performance of the multilayer adhesive stack. Soft adhesive layers may be included to optimize lateral decoupling (e.g., during folding and unfolding) of the adhesive stack. Harder layers may be included to provide rigidity and prevent denting during impact events.

Electronic devices with multilayer adhesive

Disclosed are methods of forming a chamber component for a process chamber. The methods may include filling a mold with nanoparticles or plasma spraying nanoparticles, where at least a portion of the nanoparticles include a core particle and a thin film coating over the core particle. The core particle and thin film are formed of, independently, a rare earth metal-containing oxide, a rare earth metal-containing fluoride, a rare earth metal-containing oxyfluoride, or combinations thereof. The nanoparticles may have a donut-shape having a spherical form with indentations on opposite sides. The methods also may include sintering the nanoparticles to form the chamber component and materials. Further described are chamber components and coatings formed from the described nanoparticles.

Methods of making nanopowders, nanoceramic materials and nanoceramic components

A lid or other chamber component for a process chamber comprises a) at least one surface comprising a first ceramic material, wherein the first ceramic material comprises YAlOand b) an internal region beneath the at least one surface comprising a second ceramic material, wherein the second ceramic material comprises a combination of AlOand ZrO.

Plasma resistant process chamber lid

Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of an article using an atomic layer deposition (ALD) process. The plasma resistant coating has a first layer and a second layer including a solid solution of YO—ZrOand uniformly covers features, such as those having an aspect ratio of length to width of about 3:1 to about 300:1.

Multi-layer plasma resistant coating by atomic layer deposition

Embodiments of the present disclosure relate to articles, coated articles and methods of coating such articles with a rare earth metal containing oxide coating. The coating can contain at least a first metal (e.g., a rare earth metal, tantalum, zirconium, etc.) and a second metal that have been co-deposited onto a surface of the article. The coating can include a homogenous mixture of the first metal and the second metal and does not contain mechanical segregation between layers in the coating.

Erosion resistant metal oxide coatings

Methods of forming nanoceramic materials and components. The methods may include performing atomic layer deposition to form a plurality of nanoparticles, including forming a thin film coating over core particles, or sintering the nanoparticles in a mold. The nanoparticles can include a first material selected from a rare earth metal-containing oxide, a rare earth metal-containing fluoride, a rare earth metal-containing oxyfluoride or combinations thereof.

Described herein are articles, systems and methods where a halogen resistant coating is deposited onto a surface of a chamber component using an atomic layer deposition (ALD) process. The halogen resistant coating has an optional amorphous seed layer and a transition metal-containing layer. The halogen resistant coating uniformly covers features of the chamber component, such as those having an aspect ratio of about 3:1 to about 300:1.

Halogen resistant coatings and methods of making and using thereof

A substrate support assembly includes a ground shield and a heater that is surrounded by the ground shield. The ground shield includes a plate. In one embodiment, the ground shield is composed of a ceramic body and includes an electrically conductive layer, a first protective layer on the upper surface of the plate. In another embodiment, the ground shield is composed of an electrically conductive body and a first protective layer on the upper surface of the plate.

Corrosion resistant ground shield of processing chamber

Nanopowders containing nanoparticles having a core particle with a thin film coating. The core particles and thin film coatings are, independently, formed from at least one of a rare earth metal-containing oxide, a rare earth metal-containing fluoride, a rare earth metal-containing oxyfluoride or combinations thereof. The thin film coating may be formed using a non-line of sight technique such as atomic layer deposition (ALD). Also disclosed herein are nanoceramic materials formed from the nanopowders and methods of making and using the nanopowders.

Nanopowders, nanoceramic materials and methods of making and use thereof

Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a chamber component using an atomic layer deposition (ALD) process. The plasma resistant coating has a stress relief layer and a layer comprising a solid solution of YO&#x2014;ZrOand uniformly covers features, such as those having an aspect ratio of about 3:1 to about 300:1.

Certain embodiments of the present disclosure relate to coated articles and methods of coating articles. In one embodiment, a coated article comprises an article adapted for use in a processing chamber, and a coating formed on exterior and interior surfaces of the article. In one embodiment, the coating comprises a rare earth metal-containing ceramic, and the coating is substantially uniform, conformal, and porosity-free.

A multi-layer coating for a surface of an article comprises a diffusion barrier layer and an erosion resistant layer. The diffusion barrier layer may be a nitride film including but not limited to TiN, TaN, ZrN, and TiZrN. The erosion resistant layer may be a rare oxide film comprising YZrO. The diffusion barrier layer and the erosion resistant layer may be deposited on the article's surface using a thin film deposition technique including but not limited to, ALD, PVD, and CVD.

Multi-layer coating with diffusion barrier layer and erosion resistant layer

A method of applying a multi-layer plasma resistant coating on an article comprises performing plating or ALD to form a conformal first plasma resistant layer on an article, wherein the conformal first plasma resistant layer is formed on a surface of the article and on walls of high aspect ratio features in the article. The conformal first plasma resistant coating has a porosity of approximately 0% and a thickness of approximately 200 nm to approximately 1 micron. One of electron beam ion assisted deposition (EB-IAD), plasma enhanced chemical vapor deposition (PECVD), aerosol deposition or plasma spraying is then performed to form a second plasma resistant layer that covers the conformal first plasma resistant layer at a region of the surface but not at the walls of the high aspect ratio features.

Growing community of inventors

San Jose, CA, United States of America

Xiaowei Wu